How To Guide and Results
by Gavin Bonshoron May 10, 2018 8:00 AM EST
- Posted in
- CPUs
- Guides
- APUs
- Ryzen
- Ryzen 3 2200G
- Ryzen 5 2400G
- Delidding
- Delid
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Delidding The Ryzen 2400G: The Methods and Risks AssociatedDelidding The AMD Ryzen 5 2400G: Delidding The APUDelidding The AMD Ryzen 5 2400G: Preparing The APUDelidding The Ryzen 5 2400G Results and Conclusion
Delidding is a process with the aim being to reduce CPU core temperatures on processors with a less-than-ideal thermal interface between the silicon and headspreader. The benefits of delidding a design with such an interface lead to having a cooler system, or the ability perform extra overclocking with a larger delta for thermal headroom. However, delidding a processor does carry risk, such as potentially damaging the CPU when done incorrectly and certainly voiding the warranty. In this article, we have produced a How-To guide for delidding one of the latest desktop processors: AMD’s Ryzen 5 2400G APU.
What is Delidding?
Most modern processors are manufactured with the integrated heat spreader (IHS) on top of the package, and attached to the package with a layer of glue. Between the CPU and the headspreader is a thermal interface material (TIM). The TIM is designed to transfer the heat away from the processor into the headspreader and eventually into a CPU cooler. The quality of the TIM used on modern processors can vary greatly, from a layer of cheap thermal paste to direct indium-tin soldering between the silicon die and the IHS.
Visual representation of a regular CPU versus a delidded CPU (Thanks to EKWB)
When a manufacturer decides how to package their processors, the type of TIM used is an important part of that decision. Not only does it have to be sufficient to be suitable to last 10+ years, it also has to make sure that the processor works within specifications for that time, after plenty of heat cycles. The method also has to scale — some processor families are manufactured on the scale of tens of millions, so the process has to be quick. It also has to cost appropriately per unit. Saving a single cent per unit over ten million units is a $100k saving.
A lot of discussion on the internet on this topic revolves around why the cheaper implementations do not spend $0.10 more for a better solution, especially on a $1999 product (or why a flagship product has a cheap implementation). Ultimately a fine balance has to be made — a standard TIM ‘goop/paste’ has sufficient longevity but lower performance, while a direct soldering has the best performance but might not withstand mulitple years of cycling.
‘Paste or Solder as Default’ Chart AnandTech |
||||
Intel | Year | AMD | ||
Paste | Ivy Bridge | 2012 | ||
Vishera | Soldered | |||
Trinity | Paste | |||
Paste | Haswell | 2013 | — | — |
Soldered | Ivy Bridge-E | |||
Soldered | Haswell-E | 2014 | Kaveri | Paste |
Paste | Broadwell | 2015 | Kaveri-R | Soldered |
Carrizo | Paste | |||
Paste | Skylake | |||
Soldered | Broadwell-E | 2016 | Bristol Ridge | Paste |
Paste | Kaby Lake | 2017 | Ryzen CPU | Soldered |
Paste | Skylake-X | |||
Paste | Kaby Lake-X | Threadripper | Soldered | |
Paste | Coffee Lake | 2018 | Ryzen APU | Paste |
Ryzen 2nd Gen | Soldered |
By delidding a processor, a user can replace the TIM between the die and IHS. Normally this is done to remove a cheap goopy paste solution and place a better interface, ultimately upgrading to the higher performance variant, or what some might argue should be the standard. Delidding a processor therefore works best on solutions that have the cheapest TIM implementation.
Buy Ryzen 5 2400G APU on Amazon.com
For our guide here, we have chosen to delid one of our Ryzen 2000 series APUs. While the AMD Ryzen 2000 series APUs have proven to be budget friendly light gaming workhorses, the extreme overclocker and engineer Roman ‘Der8auer’ Hartung has created and marketed a specific add-on kit/delidding tool for use in delidding the Ryzen 2000 series APUs. This is called the Delid Mate 2, which we will use today.
The conceptual idea of delidding has primarily been attributed for non-soldered CPUs, which has historically been the way that Intel has built its processors. Almost all modern mainstream Intel CPUs. such as the Intel Core i7-4770K, i7-6700K and even the newest i7-8700K use a thick goopy paste to create contact between the CPU and the IHS. For AMD’s line up, the APU processors use a similar method — so the new Ryzen 2000 series APUs and the Bristol Ridge APUs.
It should be noted that all of AMDs performanced based desktop chips such as Ryzen and Threadripper all use indium-tin solder, and do not need to be delidded. Similarly, Intel’s HEDT processors are often not delidded.
Thermal Grizzly Conductonaut Liquid Metal ($16) to replace the paste-based TIM
The idea is that replacing the cheap inefficient pre-applied paste with a thinner layer of better quality paste or liquid metal with a higher performance (measured in W/mK, Watts per Kelvin-meter) not only improves thermal conductivity and thermal heat transfer from the die, to IHS, to cooling plate, but could also allow for a quieter system as the fans do not have to work as hard.
Not the usual kind of ‘chip’ I cook up in the kitchen
What Are the Benefits?
The Ryzen 2000 series of APUs are great products for the price, and there are a couple of notable reasons why delidding one could be beneficial. The biggest application where thermals are more important are in tight spaces such as in small form factor PCs or in home theatre PCs that specialise in small form factors and quiet systems. In HTPCs, delidding would reduce the pressure on the small coolers in play, as welll as reducing noise from any fans.
Another application in delidding would be to extract every last drop of available headroom from it, whether that’s running a capable Ryzen APU past its non-delidding capabilities to increase frame rates within games, or even to shave off time in rendering video projects; the benefits are applicable to most scenarios with higher clock speeds.
In our results, shown on the last page, we saw a 12ºC reduction in temperatures when the system was fully loaded at stock frequencies, and an 11ºC reduction when overclocked to 4.1 GHz. Due to the nature of the manufacturing process, we managed another +100 MHz on the overclock as well.
What Are the Biggest Risks Involved?
First of all, the biggest risk in delidding a processor is damaging the processor during the process. The last thing that any user would want would be to destroy their brand-new chip with a dodgy slip of the wrist. Older methods of delidding processors involved using a hammer and a vice, potentially causing the CPU to fly off and hit the wall when too much power was applied (yes, I have done this personally).
The other equally big risk in delidding a processor is it instantly voids the warranty, which removes any attached rights as a consumer to returning if it goes wrong, or if it somehow dies in the process. This alone presents the biggest consequence from delidding and it shouldn’t be done on any component which cannot be afford to be replaced; RMA fraud is not condoned and will not get a further mention other than this one.
The Der8uaer Delid Die Mate 2 ($46) delidding tool with one of our Ryzen 5 2400G APUs
What Tools Do I need To Safely Delid My Ryzen 2000 Series APU?
There have been many methods that used to delid and remove the IHS from the package. The market is such that there are now specially manufactured tools for the process, such as the Der8auer Delid Die Mate 2, or 3D printed tools, including one created by a user by the name of Chri. Other methods and conspicuously risky ones at that include the hammer and vice method and cutting which involves separating the glue from the heat spreader. The risks involved with this mean one tiny miscalculation with pressure and cutting depth can ‘nick’ the die which would render the silicon potentially useless and dead.
My method to delid the Ryzen 5 2400G ($169) is to use the Der8auer Delid Die Mate 2 which retails for around $48 at Amazon. While other methods do seem somewhat attractive and ultimately cheaper, the cost of dead silicon outweighs the cost of the tools associated. I have used the Der8auer range of tools for years including the first Delid Die Mate and the Delid Die Mate X for X299 chips.
Der8auer Delid Die Mate 2 with stock screw on left, and the AMD add-on kit on the right
While the above tool was specifically manufactured with the aim of delidding Intel based Kaby Lake, Coffee Lake and even the older Sky Lake processors, an additional AMD kit is available. The kit consists of a longer M6 x 60 mm hexagon threaded bolt and an acrylic adapter to ensure the bolt doesn’t touch the pins. By virtue of AMD using a pin-grid array socket on its processors (i.e. pins on the bottom), it makes the process all that more risky.
The Tools and Materials Used to Delid the Ryzen 5 2400G
- AMD Ryzen 5 2400G APU ($169)
- Der8auer Delid Die Mate 2 ($46)
- Der8auer Delid Die Mate 2 AMD Kit ($8)
- Thermal Grizzly Conductonaut Liquid Metal ($16)
- Thermal Grizzly Liquid Metal Applicators ($8) – In case spares were needed, but not essential
Delidding The AMD Ryzen 5 2400G: Delidding The APU
Delidding The Ryzen 2400G: The Methods and Risks AssociatedDelidding The AMD Ryzen 5 2400G: Delidding The APUDelidding The AMD Ryzen 5 2400G: Preparing The APUDelidding The Ryzen 5 2400G Results and Conclusion
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Gold-Plated Zen 4 CCDs & Octopus-Styled IHS For Wider Cooler Compatibility
Steve over at Gamers Nexus recently got the opportunity to go hands-on with a delidded AMD Ryzen 7000 Desktop CPU.
AMD Ryzen 7000 CPU Delidding Reveals Gold-Plated IHS & Zen 4 CCDs With High-Quality TIM
The CPU that was delidded is part of the Ryzen 9 family since it has two dies and we know that the two CCD configuration is only applicable to the Ryzen 9 7950X & the Ryzen 9 7900X. The chip has a total of three dies, two of which are the aforementioned AMD Zen 4 CCDs fabricated on the 5nm process node and then we have the larger die around the center which is the IOD and that is based on a 6nm process node. The AMD Ryzen 7000 CCD measures at a die size of 70mm2 compared to 83mm2 for Zen 3 and feature a total of 6.57 Billion transistors, a 58% increase over the Zen 3 CCD with 4.15 Billion transistors,
Scattered around the package are several SMD’s (capacitors/resistors) that usually sit under the package substrate if we consider Intel’s CPUs. AMD is instead featuring them on the top layer and as such, they had to design a new kind of IHS which is internally referred to as the Octopus. We’ve already seen the delidded IHS before but now we get to see a final production chip with no lid on it to cover those gold Zen 4 nuggets!
With that said, the IHS is an interesting component of the AMD Ryzen 7000 Desktop CPUs. The one picture shows the arrangement of the 8 arms which Robert Hallock ‘Director of Technical Marketing at AMD’ refers to as the ‘Octopus’. Each arm has a small application of TIM beneath it which is used to solder the IHS to the interposer. Now delidding the chip is going to be really hard since each arm is right next to the massive array of capacitors. Each Arm is also slightly raised to make room for the SMDs and users shouldn’t worry about heat getting trapped beneath.
AMD Ryzen 7000 Desktop CPU Delidded (Image Credits: GamersNexus):
2 of 9
Der8auer has also given a statement to Gamers Nexus regarding his upcoming delidding kit for AMD Ryzen 7000 Desktop CPUs which is in the works and he also seems to explain why the new CPUs feature gold-plated CCDs:
Regarding the gold coating, there’s the aspect that you can solder indium to gold without the need of flux.
This makes the process easier and you don’t need aggressive chemicals on your CPU. Without the gold coating, it would theoretically also work to solder the silicon to copper, but it would be more difficult and you would need the flux to break the oxide layers.
Der8auer to GamersNexus
The most interesting area of the AMD Ryzen 7000 Desktop CPU IHS, besides the arms, is the gold plated IHS which is used to increase thermal dissipation off of the CPU/IO dies and directly to the IHS. The two 5nm Zen 4 CCD’s and singular 6nm IO die have liquid-metal TIM or Thermal interface material for better heat conductivity and the aforementioned gold plating does help a lot with heat dissipation. What remains to be seen is whether the capacitors will feature silicone coating or not but from the previous package shot, it kind of looks like they do.
It is also reported that the smaller surface area of the IHS means that it will be better compatible with existing coolers with round and square-shaped cold plates. Square-shaped cold plates will be the preferred choice but round ones will work just fine too. Noctua has also pointed out the TIM application method and they are suggesting users go with the single-dot pattern in the middle of the IHS for AMD AM5 CPUs.
There are also reports based on the thermal density of the chip that it might run out. Considering that the Zen 4 chiplets are smaller than their predecessor but much denser, they will require a lot of cooling. It looks like that might be one reason why the chiplets are also gold-plated this time to effectively move as much heat away from them and to the IHS. While 170W is the peak TDP rating of the CPU, its PPT or maximum package power is rated at 230W and a 280W figure is used for OC. The figures also include the IO die which should be around 20-25W by itself. Following is a thermal density breakdown by Harukaze5719:
AMD Ryzen 7000 Desktop CPU Render (With/Without IHS):
2 of 9
Another thing that needs to be pointed out is that each Zen 4 CCD is really close to the edge of the IHS which wasn’t necessarily the case with previous Zen CPUs. So not only delidding will be highly difficult but the center is mostly the IO die which means that cooling equipment needs to be ready for such chips. The AMD Ryzen 7000 Desktop CPUs launch in Fall 2022 on the AM5 platform. That’s a chip that can reach up to 5.85GHz with up to 230W package power so every little amount of cooling will be a must for overclockers and enthusiasts.
AMD Mainstream Desktop CPU Generations Comparison:
AMD CPU Family | Codename | Processor Process | Processors Cores/Threads (Max) | TDPs (Max) | Platform | Platform Chipset | Memory Support | PCIe Support | Launch |
---|---|---|---|---|---|---|---|---|---|
Ryzen 1000 | Summit Ridge | 14nm (Zen 1) | 8/16 | 95W | AM4 | 300-Series | DDR4-2677 | Gen 3.![]() |
2017 |
Ryzen 2000 | Pinnacle Ridge | 12nm (Zen +) | 8/16 | 105W | AM4 | 400-Series | DDR4-2933 | Gen 3.0 | 2018 |
Ryzen 3000 | Matisse | 7nm (Zen 2) | 16/32 | 105W | AM4 | 500-Series | DDR4-3200 | Gen 4.0 | 2019 |
Ryzen 5000 | Vermeer | 7nm (Zen 3) | 16/32 | 105W | AM4 | 500-Series | DDR4-3200 | Gen 4.0 | 2020 |
Ryzen 5000 3D | Warhol? | 7nm (Zen 3D) | 8/16 | 105W | AM4 | 500-Series | DDR4-3200 | Gen 4.0 | 2022 |
Ryzen 7000 | Raphael | 5nm (Zen 4) | 16/32 | 170W | AM5 | 600-Series | DDR5-5200 | Gen 5.0 | 2022 |
Ryzen 7000 3D | Raphael | 5nm (Zen 4) | 16/32? | 105-170W | AM5 | 600-Series | DDR5-5200/5600? | Gen 5.![]() |
2023 |
Ryzen 8000 | Granite Ridge | 3nm (Zen 5)? | TBA | TBA | AM5 | 700-Series? | DDR5-5600+ | Gen 5.0 | 2024-2025? |
Is it worth Delidding your CPU?
You Can Run Your PC In Hotter Environments
Reducing overall CPU temps by delidding can make a difference. You’ll still need top-notch external cooling elements like paste, heat sink, and fans (if you’re not liquid cooling), but delidding is one element to consider.
View complete answer on tomshardware.com
What is the point of Delidding?
For the uninitiated, delidding is the act of separating the integrated heat spreader (IHS) from the top of your processor, and then replacing the stock thermal paste the manufacturer has used, with something a little more premium, usually liquid metal or a better thermal paste.
View complete answer on tomshardware. com
Does Delidding void warranty?
No delid voids warranty.
View complete answer on overclock.net
Is liquid metal only for Delidding?
Delidding requires that you use only liquid metal between the Die and IHS. Typical silicon TIM will fail in a relatively brief period of time. A process known as “pump-out” will cause silicon TIM to ooze out from between the Die and IHS due to thermal cycling.
View complete answer on forums.tomshardware.com
Do you need to Delid AMD CPUs?
It should be noted that all of AMDs performanced based desktop chips such as Ryzen and Threadripper all use indium-tin solder, and do not need to be delidded. Similarly, Intel’s HEDT processors are often not delidded.
View complete answer on anandtech.com
Is It Worth Delidding your CPU?
View complete answer on forums.tomshardware.com
Are AMD CPUs soldered?
As far as I know, AMD still solders all of it’s CPUs to the IHS. This is unlike Intel, who uses a TIM on the IHS and has been said to offer poorer performance and degrade over time.
View complete answer on reddit.com
How long does liquid metal last?
Considering that manufacturers are starting to use it (such as in the PlayStation 5 or ASUS with some of their laptops), the chances it will last at least a few years to indefinitely. But it could depend on a variety of factors, such as the LM you use, the application, etc.
View complete answer on forums.tomshardware.com
What does Delidding a CPU mean?
The process of removing a CPU’s IHS (integrated heat spreader). An IHS absorbs and spreads out heat from a CPU to its heat sink to keep it cooler. You would delid a CPU in order to replace it with an alternative thermal material for an even cooler PC. This is relevant if you want to overclock your machine.
View complete answer on tomshardware.com
Is liquid metal thermal paste worth it?
Yes, liquid metal has a higher thermal conductivity but has significant risks in the application. And therefore, best left to those who know what they are doing. On the other hand, thermal paste is cheaper, but you’ll have to deal with its lower thermal conductivity ratings.
View complete answer on makeuseof.com
What is lapping CPU?
Lapping a CPU is a process by which you sand the top of a CPU’s case until it is as close to perfectly smooth as possible.
View complete answer on smallbusiness.chron.com
What is overclocking on a gaming PC?
To speed up the computer beyond the manufacturer’s specifications in order to run faster. Common in the gaming world, overclocking the CPU is accomplished by changing the clock ratio of the frontside bus (FSB) in the BIOS setup (see CPU multiplier).
View complete answer on pcmag.com
Does the ps5 use liquid metal?
The PS5’s cooling solution is pretty advanced and uses three main parts: a dual-sided 120mm intake fan, a complex vapor-chamber heat sink design, and a layer of liquid metal that conducts heat from the PS5’s main processor chip and passes it to the heat sink.
View complete answer on tweaktown.com
Is Ryzen soldered?
AMD will continue to use solder in the Ryzen 3000 series of desktop CPUs to connect the different dies to the main heat spreader. That will probably not come as much of a surprise to regular readers, given that the Ryzen 2000 and the more-recent 3000-series APUs have all come soldered, but it is still welcome news.
View complete answer on pcgamesn.com
Is 3700x soldered?
AMD Ryzen 3000 series processors will feature a soldered integrated heat spreader (IHS). This comes as no surprise as the previous AMD Ryzen processors also featured a soldered IHS. A soldered IHS, for the heat dissipation of the processor, overall is better than using paste.
View complete answer on guru3d.com
How do you remove Ryzen IHS?
If you have lots of dark puddles, you can simply use the Q-tip to remove excess or if you manage to get it around outside of the raised section of the IHS or on the SMDs, pure acetone (not containing aqua) is the easiest method of removing it.
View complete answer on anandtech.com
How much can you overclock 5950x?
We ultimately reached a maximum overclock of 5117 MHz for a single core and an average of 4942 MHz across all cores. This is still 100 MHz short of what the Precision Boost algorithm should be able to boost at after adjusting the maximum boost limit to 5225 MHz.
View complete answer on skatterbencher.com
Can you Delid a 5600X?
You can send your 5600X to silicon lottery. For $40, they will delid the processor and in the testing process provide you a bin assessment.
View complete answer on forums.tomshardware.com
Is Ryzen 5000 soldered IHS?
The CPU in particular is the AMD Ryzen 5 5600X which features two chiplets, a single CCD, and the primary IOD. To get the die shots, the CPU had to be delidded by removing the IHS. The Ryzen 5000 CPUs make use of a solder design which makes it hard to delid the chip and disaster struck as Fritz tried to delid the chip.
View complete answer on wccftech.com
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Intel i7-8700K Review vs.
Ryzen: Streaming, Gaming, Delidding | GamersNexus
Hardware
Intel i7-8700K Thermals & Delidding
We’ll start this one with thermals and delidding, since that’s been a popular topic lately. We’re running these tests with fixed frequencies and voltages, as that’s the only way to properly control for fluctuations in CPU behavior. We used Rockit Cool’s $40 delid kit to remove the IHS. It proved trivial to use and worked flawlessly which, for a $40 kit, is pretty damn good. We can recommend this one for Coffee Lake delids – the previous model for Kaby Lake CPUs will also work here, and delidding the 8700K is easier than the Skylake X CPUs as it lacks the dual-substrate layout.
Delidding the CPU was matched with removing the silicone adhesive from the IHS, and applying Thermal Grizzly Conductonaut liquid metal.
i7-8700K Delid Thermals: Blender at 4.9GHz / 1.4Vcore
Let’s start with the more exaggerated results: When testing Blender with a 4. 9GHz frequency and 1.4 core voltage, our 8700K with Intel TIM and an NZXT X62 landed at 76C average core temperature, with a 10-second peak of 76.6C and a liquid temperature of 40.65C. The liquid metal version at the same frequency and voltage measured at 52.59C, or a reduction in average core temperature of nearly 24C.
Liquid temperature measured about the same as before, at 39.82C. Looking into this further, we realized that, measured at a current clamp on the EPS12V rails, the 8700K with TIM was drawing about 10-20W more power at the same voltage and frequency. We’re not yet positive, but our present theory is that this outcome is a result of power leakage reduction on the CPU as a result of improved energy transfer efficiency from the die to the IHS.
i7-8700K Delid Thermals: Prime95 4.7GHz / 1.35Vcore
Testing with Prime95 28.5 and the CPU locked to 4.7GHz core, 1.35Vcore, we found the delta much closer than in the earlier overvolted test. The TIM test plants us at 62. 6C average core temperature, with the 10-second high at 63.82C. Liquid temperature is effectively matched to the liquid metal version, at 39.6C versus 39.8C. This is within our test resolution and error. Using Conductonaut, we’re at 52.59C, for a 10-degree reduction in average core temperature.
This isn’t as big of a deal as with the Skylake-X CPUs, where we were constrained in overclocking by thermal limits, but is still worth considering for higher voltage overclocks. Coffee Lake actually runs reasonably cool, all things considered, and doesn’t need a delid for consumer overclocks (like the 7960X did). That said, a 10-20-degree reduction is no small feat, and means lower fan RPMs to achieve the same temperature. For anyone planning to push higher overclocks, we can recommend the liquid metal and delidder that we used. If you’re worried about successful delids, we’ve heard that Silicon Lottery plans to start binning Coffee Lake CPUs within the next week, and they offer a delidding service on frequency-binned CPUs.
As for the results here, Coffee Lake clearly isn’t in nearly as much need as Skylake-X for delids with overclocks. To be clear, none of the CPUs “need” to be delidded – but Skylake-X benefits in big ways from the move, as we were becoming thermally constrained prior to encountering voltage constraints when overclocking. With Coffee Lake, the constraint was primarily voltage or frequency stability, not thermals. The improved transfer efficiency does help reduce power leakage and benefit everything a bit, of course, but it’s not a hard requirement for overclocking. There are big gains to be had from delidding the 8700K, they just aren’t as ensconced in grandeur as the Sky-X delidding. The CPU works just fine without a delid. We’d still recommend it for serious overclocks, but it’s not “needed,” as some earlier rumors falsely indicated.
Continue to the next page for power consumption tests.
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Steve Burke
Steve started GamersNexus back when it was just a cool name, and now it’s grown into an expansive website with an overwhelming amount of features. He recalls his first difficult decision with GN’s direction: «I didn’t know whether or not I wanted ‘Gamers’ to have a possessive apostrophe — I mean, grammatically it should, but I didn’t like it in the name. It was ugly. I also had people who were typing apostrophes into the address bar — sigh. It made sense to just leave it as ‘Gamers.'»
First world problems, Steve. First world problems.
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AMD Ryzen 7000 Desktop CPU Delidded: Gold-Plated Zen 4 CCDs & Octopus-Styled IHS For Wider Cooler Compatibility — Wccftech
Steve over at Gamers Nexus recently got the opportunity to go hands-on with a delidded AMD Ryzen 7000 Desktop CPU.
AMD Ryzen 7000 CPU Delidding Reveals Gold-Plated IHS & Zen 4 CCDs With High-Quality TIM
The CPU that was delidded is part of the Ryzen 9 family since it has two dies and we know that the two CCD configuration is only applicable to the Ryzen 9 7950X & the Ryzen 9 7900X. The chip has a total of three dies, two of which are the aforementioned AMD Zen 4 CCDs fabricated on the 5nm process node and then we have the larger die around the center which is the IOD and that is based on a 6nm process node. The AMD Ryzen 7000 CCD measures at a die size of 70mm2 compared to 83mm2 for Zen 3 and feature a total of 6.57 Billion transistors, a 58% increase over the Zen 3 CCD with 4.15 Billion transistors,
Scattered around the package are several SMD’s (capacitors/resistors) that usually sit under the package substrate if we consider Intel’s CPUs. AMD is instead featuring them on the top layer and as such, they had to design a new kind of IHS which is internally referred to as the Octopus. We’ve already seen the delidded IHS before but now we get to see a final production chip with no lid on it to cover those gold Zen 4 nuggets!
With that said, the IHS is an interesting component of the AMD Ryzen 7000 Desktop CPUs. The one picture shows the arrangement of the 8 arms which Robert Hallock ‘Director of Technical Marketing at AMD’ refers to as the ‘Octopus’. Each arm has a small application of TIM beneath it which is used to solder the IHS to the interposer. Now delidding the chip is going to be really hard since each arm is right next to the massive array of capacitors. Each Arm is also slightly raised to make room for the SMDs and users shouldn’t worry about heat getting trapped beneath.
AMD Ryzen 7000 Desktop CPU Delidded (Image Credits: GamersNexus):
Der8auer has also given a statement to Gamers Nexus regarding his upcoming delidding kit for AMD Ryzen 7000 Desktop CPUs which is in the works and he also seems to explain why the new CPUs feature gold-plated CCDs:
Regarding the gold coating, there’s the aspect that you can solder indium to gold without the need of flux. This makes the process easier and you don’t need aggressive chemicals on your CPU. Without the gold coating, it would theoretically also work to solder the silicon to copper, but it would be more difficult and you would need the flux to break the oxide layers.
![]()
Der8auer to GamersNexus
The most interesting area of the AMD Ryzen 7000 Desktop CPU IHS, besides the arms, is the gold plated IHS which is used to increase thermal dissipation off of the CPU/IO dies and directly to the IHS. The two 5nm Zen 4 CCD’s and singular 6nm IO die have liquid-metal TIM or Thermal interface material for better heat conductivity and the aforementioned gold plating does help a lot with heat dissipation. What remains to be seen is whether the capacitors will feature silicone coating or not but from the previous package shot, it kind of looks like they do.
It is also reported that the smaller surface area of the IHS means that it will be better compatible with existing coolers with round and square-shaped cold plates. Square-shaped cold plates will be the preferred choice but round ones will work just fine too. Noctua has also pointed out the TIM application method and they are suggesting users go with the single-dot pattern in the middle of the IHS for AMD AM5 CPUs.
AMD Ryzen 7000 Desktop CPU Render (With/Without IHS):
Another thing that needs to be pointed out is that each Zen 4 CCD is really close to the edge of the IHS which wasn’t necessarily the case with previous Zen CPUs. So not only delidding will be highly difficult but the center is mostly the IO die which means that cooling equipment needs to be ready for such chips. The AMD Ryzen 7000 Desktop CPUs launch in Fall 2022 on the AM5 platform. That’s a chip that can reach up to 5.85GHz with up to 230W package power so every little amount of cooling will be a must for overclockers and enthusiasts.
AMD Mainstream Desktop CPU Generations Comparison:
AMD CPU Family | Codename | Processor Process | Processors Cores/Threads (Max) | TDPs (Max) | Platform | Platform Chipset | Memory Support | PCIe Support | Launch |
---|---|---|---|---|---|---|---|---|---|
Ryzen 1000 | Summit Ridge | 14nm (Zen 1) | 8/16 | 95W | AM4 | 300-Series | DDR4-2677 | Gen 3. |
2017 |
Ryzen 2000 | Pinnacle Ridge | 12nm (Zen +) | 8/16 | 105W | AM4 | 400-Series | DDR4-2933 | Gen 3.0 | 2018 |
Ryzen 3000 | Matisse | 7nm (Zen 2) | 16/32 | 105W | AM4 | 500-Series | DDR4-3200 | Gen 4.0 | 2019 |
Ryzen 5000 | Vermeer | 7nm (Zen 3) | 16/32 | 105W | AM4 | 500-Series | DDR4-3200 | Gen 4.0 | 2020 |
Ryzen 5000 3D | Warhol? | 7nm (Zen 3D) | 8/16 | 105W | AM4 | 500-Series | DDR4-3200 | Gen 4.0 | 2022 |
Ryzen 7000 | Raphael | 5nm (Zen 4) | 16/32 | 170W | AM5 | 600-Series | DDR5-5200 | Gen 5.0 | 2022 |
Ryzen 7000 3D | Raphael | 5nm (Zen 4) | 16/32? | 105-170W | AM5 | 600-Series | DDR5-5200/5600? | Gen 5. |
2023 |
Ryzen 8000 | Granite Ridge | 3nm (Zen 5)? | TBA | TBA | AM5 | 700-Series? | DDR5-5600+ | Gen 5.0 | 2024-2025? |
AMD Ryzen 5000 Zen 3 ‘Vermeer’ CPU die shot pictured, revealing the core topology and architecture
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Metal Messiah 5 Comments
As you know AMD recently announced its Ryzen 5000-series Zen 3-based Vermeer desktop CPU lineup. According to AMD these CPUs will offer better single-thread performance in PC games. AMD also lifted the review embargo and first third-party gaming benchmarks were also published.
AMD’s Zen 3 architecture promises to offer a higher boost clock, significant IPC uplift, new core layout, and a new cache topology. In fact, AMD also claims that Zen 3 offers a 19% increase in single-thread scenarios over the previous-gen CPU lineup. AMD released four SKUs based on Zen 3 arch, the Ryzen 5 5600X, Ryzen 7 5800X, Ryzen 9 5900X and the Ryzen 9 5950X, respectively.
Now someone has decided to delid this new ZEN 3-based CPU, and has posted some high-resolution infrared photos of the processor/die. One Hardwareluxx community member grabbed a Ryzen 5 5600X, delidded it and tried to take a look under the processor’s hood.
The Die shot has been posted by Fritzchens Fritz, and more pictures can be found in this Flickr photo stream album. Fritzchens has posted many CPU/GPU die shots in the past as well.
https://t.co/uEF14XgsB6 pic.twitter.com/KKkHd7UXKt
— Fritzchens Fritz (@FritzchensFritz) November 8, 2020
You’ll immediately notice the damage done when the user de-lidded the processor, but there are other pictures revealing some details of the die shot. The CPU in particular is the AMD Ryzen 5 5600X. From the photos we can clearly see both the I/O Die (IOD) and the Core Compute Die (CCD) that houses the eight Zen 3 cores on the Ryzen 5 5600X, but two of them are disabled to make a six-core chip.
The processor features two chiplets, a single CCD, and a primary IOD. The CPU had to be delidded by removing the IHS to get a clear picture of the die. Ryzen 5000 CPUs basically make use of a ‘solder design’ so it was not easy to delid this processor, since the whole CCD ripped off during the process as evident from the photos.
We can see mounting pads next to the CCD, reserved for a second CCD, which would be used to install a Ryzen 9 chip. In the close-up die shots, you can see some of the CPU cores and the L3 cache in the middle of the CCD as well. One Twitter user @Locuza has mapped the rest of the Ryzen 5000 die, the entire Zen 3 CCD, with each area of the chip being accurately mapped.
Awesome work by Fritzchens again!
FPU and uCode position appears to be the same.
L1D$ looks very similar.
uOP$, L1I$, BTBs were moved a bit and look quite different.
L2$ appears nearly identical.
L3$ design has multiple changes.![]()
A Zen3 core is quite a bit longer than a Z2 Core https://t.co/NVC1I9XlUW pic.twitter.com/G6TlsjQ2eg— Locuza (@Locuza_) November 8, 2020
He highlighted some important points:
- FPU and uCode position appears to be the same.
- L1D$ looks very similar.
- uOP$, L1I$, BTBs was moved a bit and look quite different.
- L2$ appears nearly identical.
- L3$ design has multiple changes.
- Zen3 core is quite a bit longer than a Z2 Core
In previous gen Ryzen CPU design each CCD comprised of two CCX’s (Core Complexes). Zen 3 CCD on the other hand consists of a single CCX featuring 8 cores that can run in either a single-thread mode (1T) or a two-thread mode (2T), up to 16 threads in total per CCX.
Both the 3rd and 4th-gen AMD Ryzen architectures work on a multi-die based system. The cores and cache are housed in their own dies called CCDs. The memory, I/O, and all communication between CCDs done via the AMD Infinity Fabric is handled by the I/O Die. So AMD can basically use different nodes for different dies to manufacture CPUs.
The bigger I/O die uses TSMC’s 12nm process, while the CCDs use the 7nm node, again from TSMC. AMD Zen 3 CCX consists of 512KB of L2 per core for a total of 4MB L2 cache per CCD, and up to 32MB of L3 cache shared across all the cores.
Moreover, AMD Zen 3 CCD measures at 83.736mm2. For comparison, the Zen 2 CCD was around 72mm2. This means Zen 3 CCD is almost 16% larger in size. The 12nm IOD (I/O Die) measures at 124.29mm2, same as previous gen Ryzen 3000-series CPU lineup. The I/O die appears to be the biggest chip on the interposer.
Stay tuned for more!
Metal Messiah
Hello, my name is NICK Richardson. I’m an avid PC and tech fan since the good old days of RIVA TNT2, and 3DFX interactive «Voodoo» gaming cards. I love playing mostly First-person shooters, and I’m a die-hard fan of this FPS genre, since the good ‘old Doom and Wolfenstein days.
MUSIC has always been my passion/roots, but I started gaming «casually» when I was young on Nvidia’s GeForce3 series of cards. I’m by no means an avid or a hardcore gamer though, but I just love stuff related to the PC, Games, and technology in general. I’ve been involved with many indie Metal bands worldwide, and have helped them promote their albums in record labels. I’m a very broad-minded down to earth guy. MUSIC is my inner expression, and soul.
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Best AMD Ryzen processors of 2022: TOP 5
Best Red Team chips.
Best
AMD processors are capable of everything from multitasking, where Ryzen is the undisputed champion, to
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Speaking of the best PC gaming, the best AMD processors compete with the best Intel processors, including the acclaimed Intel Core i9-12900K. With a new cache technology known as AMD 3D V-Cache, the company has struck the perfect balance between performance and affordability.
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Not
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categories, we also looked at processors capable of offering a high
performance at a more affordable price for the most frugal users.
Our ranking of the best AMD processors will help you with your search so you can do more
take the time to assemble the computer.
Like us
testing the best AMD processors?
Impossible
tell the best processors from the worst just by looking at them. Majority
computer components looks the same, even if you open the metal
cover, transistors (the neurons of the «brain» of the CPU) are literally measured in nanometers. How
distinguish a million transistors on a chip from a billion and how to determine the clock
cpu frequency just by looking at it?
K
Fortunately, there are tests we run to see how well
the processor works in practice, and the best way to evaluate it is to bring it to
limit using precisely calibrated testing tools,
which return comparable scores depending on how well
the processor copes with certain tasks, whether it is compressing video files or
performing complex mathematical operations used in 3D games.
We
rely on industry standard tools such as Geekbench
5, Cinebench R23 and PCMark
10 to push processors to their limits in a controlled environment using
realistic workloads that you are likely to face in
daily use of the computer.
We
we also launch modern computer games with different graphics
settings to evaluate the gaming performance of the processor.
Then,
having received the test suite scores, we try them on the price. best processors,
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Best
2022 AMD processors
1. AMD Ryzen 9 5900X
The best processor for the most demanding games.
Cores : 12 | Threads : 24 | Base frequencies : 3.7 GHz | Maximum frequencies : 4.8 GHz | L3 cache : 64 Mb | TDP : 105W.
Pros:
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Cons :
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AMD Ryzen 9 5900X offered the biggest step
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Support for older motherboards is an added bonus.
Read more : AMD Ryzen 9 5900X review
2. AMD Ryzen 7 5800X3D
The best gaming processor at the beginning of the year.
Cores : 8 | Threads : 16 | Base frequencies : 3.7 GHz | Maximum frequencies : 4.7 GHz | L3 cache : 100 MB | TDP : 105W.
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AMD
The Ryzen 7 5800X3D is without a doubt one of the best gaming processors on the market.
market. Its amazing performance is dictated by an interesting approach to
AMD 3D V-Cache, Processor 5800X3D
surpasses
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i9-12900K in some games.
In fact,
you are looking at the original AMD Ryzen 7 5800X whose cache was
modified, but this does not cancel its correspondence to the AM4 motherboard sockets, which
makes upgrading much cheaper if you’re swapping from one Ryzen to another.
Recall
Assumes AMD AM4 motherboard. If a
no, you still have to buy a new motherboard and possibly change
cooling, which undermines the benefit of the Ryzen 7 5800X3D and may tempt the user to
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gaming performance, but will raise the computer’s capabilities in other
areas.
Read the full review AMD Ryzen 7 5800X3D
Cores : 6 | Threads : 12 | Base frequencies : 3. 8 GHz | Maximum frequencies : 4.4 GHz | L3 cache : 32 Mb | TDP : 95W.
- Pros: Excellent performance | Affordable | Cooler included;
- Cons : Only six cores;
Demonstrating
impressive multi-threaded performance and competitive performance
even in the heaviest single-threaded applications, this mid-range processor
occupies the throne of the best AMD processor for gaming. In addition, AMD
The Ryzen 5 3600X doesn’t stop there: it raises the budget
performance to a new level, thanks to the growth of IPC performance (number of
commands per beat) and higher base frequencies while retaining the pricing of the past
generations. We must take a point.
More : AMD Ryzen 5 3600X Review
4. AMD Ryzen 7 5800X
Top of the Ryzen food chain.
Cores : 8 | Threads : 16 | Base frequencies : 3. 8 GHz | Maximum frequencies : 4.7 GHz | L3 cache : 32 Mb | TDP : 105W.
Pros:
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Cons:
- Price increase relative to the 3rd generation;
- Cooler not included;
Intel used to monopolize
gaming processor market, but everything has changed with the release of AMD Ryzen 7 5800X
– 8-core,
16-thread processor with surprisingly high (for AMD) single-core
performance, which makes the processor one of the best for gaming, as well as
demanding graphic tasks. Its price is well below most
competing Intel offerings, making the choice clear and
beneficial.
Read more : AMD Ryzen 7 5800X Review
5. AMD Ryzen 9 3950X
Shiny like HEDT processors.
Cores : 16 | Threads : 32 | Base frequencies : 3. 5 GHz | Maximum frequencies: 4.7 GHz | L3 cache : 64 Mb | TDP : 105W.
- Pros : Cheaper than HEDT | PCIe 4.0 | Installed in AM4;
- Cons : Add. cooling | Limited game gain;
AMD Ryzen 9 3950X is so good that during
review, we were not shy in laudatory expressions, since, with regard to
processors outside of HEDT (High End
Desktop), built on AMD’s 7nm process
Zen 2, it offered a whopping 16 cores and 32 threads, which makes the processor
an ideal choice for complex graphics work at the computer. If you are looking for
one of the best AMD Ryzen processors that can chew through any
heavy workloads, as well as playing demanding AAA games in the evening, AMD
Ryzen 9The 3950X is a worthy choice.
Read More : AMD Ryzen 9 3950X Review
How to Choose
right AMD processor for you?
When
it comes to choosing the best AMD processor, besides the budget is decisive
what matters is your needs, from which the requirement for the processor is formed. You
you can buy not only a weak, but also a too powerful processor, so buying yourself
the fastest processor on the market is the most common mistake.
If
you only need general performance for tasks like surfing the net
Internet, movie watching and light work, Ryzen 3 and Ryzen 5 processors will become
more than enough, Ryzen 7 and Ryzen 9 series processorswill be redundant. They won’t do
your user experience is better, but they will make your wallet much better
thinner.
If you
plan to play a lot of computer games or create content, you
you should definitely choose between Ryzen 7 or Ryzen 9, as for Ryzen 5 gaming
loads at the limit, and with Ryzen 3 you will not be able to play
something harder than Candy Crash.
What
AMD processor is better?
All
depends on what you call the best. When it comes to pure
performance, AMD Ryzen 95950X is the fastest
consumer processor in AMD’s lineup for 2022, but it’s not particularly
faster than the Ryzen 9 5900X, but costs significantly more, so the value ratio
it’s not the best here.
If
it’s about pure gaming performance, you should consider the Ryzen 7 5800X3D. know-how
called 3D V-Cache in Ryzen 7 is an important technological
a breakthrough that significantly affects gaming performance and the number of
frames per second.
What
fastest AMD processor?
If us
interested in the fastest AMD processor in the world, it will be 64-core / 128-thread
Ryzen
Threadripper
3990X, but it’s a High End Desktop (HEDT) class processor. it
means it’s designed for the most serious productivity tasks like 3D rendering
real-time audio editing with dozens of simultaneous
digital tools. And it’s also an indecently expensive processor, which at least
twice as expensive as probably the fastest consumer gaming PC.
What
applies to AMD consumer processors, AMD Ryzen 9 5950X
as fast as
it is possible.
AMDProcessors
AMD and Intel have suspended the supply of their products to Russia — RBC
The largest US processor manufacturers Intel and AMD will suspend the supply of their products to Russia. This may lead to a shortage of servers and an increase in their cost
Photo: Shannon Stapleton / Reuters
Two sources in the IT market told RBC that the largest processor manufacturers AMD and Intel have suspended deliveries of their products to Russia.
According to one of them, these companies verbally told Russian manufacturers that AMD and Intel products are temporarily not being shipped to Russia. Chinese partners are already receiving notifications from the local Intel office about a ban on the supply of processors to Russia, he added. The suspension of deliveries of processors from AMD and Intel was also confirmed by a representative of the Association of Russian Developers and Electronics Manufacturers (ARPE).
An Intel representative in Russia did not directly answer the question of whether they stopped the supply of processors, but said that «the company is closely monitoring the situation and is enforcing applicable sanctions and export control rules, including new sanctions imposed by OFAC and rules issued by BIS (Bureau of Industry and Security under the US Department of Commerce, which is the export control regulator. — RBC )».
www.adv.rbc.ru
An AMD representative declined to comment. A representative of the Ministry of Industry and Trade of Russia also entered.
www.adv.rbc.ru
On February 25, BIS published details of new restrictions on the export of technological products for Russian industries.
The corresponding document «in response to Russia’s further invasion of Ukraine» will come into force on March 3 this year. American companies will have to obtain licenses from the US authorities to export BIS-controlled products to Russia, including electronics, computers, avionics, aerospace components, etc. It is assumed that the US will give approval for export only in exceptional cases.
The presumption of refusal will not apply only to supplies necessary to ensure the safety of civil flights, maritime security, humanitarian needs, Russian-American cooperation in space exploration, the work of Russian subsidiaries of Western corporations.
At the same time, for «consumer communication devices» — personal computers, modems, mobile phones and digital cameras — the US Department of Commerce made an exception, these devices can be freely supplied to Russia for use by individuals, except for the Russian authorities and a whole list of officials, including the president, prime minister minister, deputy prime ministers, federal ministers, deputies of the State Duma and members of the Federation Council, chief editors and deputy editors-in-chief of state media. The ban will apply not only to the supply of US-made high-tech goods, but also to all goods that use American technology.
Intel and AMD are the largest chip manufacturers in the world. Among Russian companies, their products are used by manufacturers of computers, monoblocks, data storage systems and other electronic equipment. In addition, Intel and AMD processors are used in the supercomputers of Sberbank, Moscow State University, Yandex and MTS.
According to one of RBC’s interlocutors in the IT market, the new rules of the game are still not fully understood. “Perhaps for the supply of computers, servers, software, telecommunications equipment, etc. Russian companies will need to obtain an export license. The process of obtaining it takes from one to six months, but there are no guarantees for a positive result. And if for each order it will be necessary to obtain an export license from BIS, this will be a very difficult story for market players, ”said RBC’s interlocutor.
RBC’s source, close to one of the Russian manufacturers, says that the restrictions do not apply to the consumer segment of end devices. “However, everything related to the industrial segment is banned, including the import of production equipment and components, which will definitely have a negative impact on domestic production,” RBC’s interlocutor said.
However, another market participant says that, despite the fact that some foreign computer manufacturers say that the ban should not apply to the supply of assembled computers, they may later reconsider their position, because “there are sanctioned components inside these computers that are not subject to re-export” . At the same time, he noted that in recent years, thanks to the support of the Ministry of Industry and Trade and the Ministry of Digital Development, the development of Russian microelectronics has «quite seriously pulled up» and the task of creating an alternative to Intel and AMD processors is «quite real.»
According to Maxim Koposov, director of the Promobit company (manufacturer of BITBLAZE servers and storage systems based on Russian Elbrus processors), how exactly the restrictions will work and where the line will be drawn between consumer communication devices and computing equipment, such as servers and video accelerators , — practice will show.
“Russian manufacturers and customers will look for ways to work in the new environment. Where possible, through an increase in the use of Russian or non-American components, or through the use of exceptions left by the US Department of Commerce,” Koposov said.
At the same time, one of RBC’s interlocutors pointed out that Russian companies may try to buy foreign processors through some alternative channels, for example, from Chinese companies. “Here everything will depend on the direction of the business: if the main customer is a company from the US and Europe, then they will be very reluctant to cooperate with Russia, because this may disrupt their core business. If the main business is the domestic market, then intergovernmental agreements can help Russian manufacturers, ”says a RBC source.
The use of Russian processors, according to him, may be complicated if the Taiwanese factory TSMC, which produces Russian processors Elbrus, Baikal, Skif, and others, refuses to work with them. In this case, their production may stop, since it is “very difficult” to transfer it to another factory, the source explained.
On Friday, February 25, Kommersant, citing a government source, wrote that Russian microelectronics developers had received a notification from TSMC that the US authorities were demanding that the company cease cooperation with Russian contractors. Reuters later reported that TSMC promised to fully comply with the new export control rules. In response to a question from RBC about whether this means that TSMC will not supply products to Russian companies, a representative of the vendor said that they «do not comment on speculation and market rumors.»
CEO of Norsi-Trans (produces equipment based on Russian processors) Sergey Ovchinnikov says that so far there have been no official statements from TSMC that they are blocking the production of Russian processors. He also said that if such a ban appears, there are «other Chinese factories.» In his opinion, the refusal to supply products from Intel and AMD will lead to a serious shortage of servers, since the production volumes of processors by domestic companies «will not be able to cover the needs of the market.»
At the end of January, assessing the risks of a ban on the supply of high-tech products using American technologies to Russia, RBC’s interlocutor in the computer market said that any electronic product «uses solutions from the United States.» Among the consequences of such sanctions, experts called the complication of the supply of components and, as a result, an increase in their cost. According to one of the market participants, prices for all equipment can grow by «at least 30%.»
Representatives of Aquarius, GS Group, MCST (developer of Elbrus processors), Baikal Electronics (develops processors of the same name), IVA Technologies and Yandex declined to comment. RBC sent a request to SPC Elvis, STC Module, KNS Group (produces servers under the Yadro brand), MTS and Sberbank, as well as Huawei, Honor, HP and several other foreign electronics manufacturers.
AMD processors slow down under Linux due to crooked code 20 years ago
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There is code in the Linux kernel that prevents modern AMD chips from running at full capacity. He is already 20 years old, but at the time of release he was necessary for the correct operation of the processors of those years. The problem did not affect the Intel CPUs — they have built-in protection against it. A new kernel patch is ready — it was developed inside AMD and has already proven its effectiveness.
When old technology gets in the way
Modern AMD processors are unable to reach their potential in Linux distributions due to a patch to the kernel added 20 years ago, in 2002. not a single new processor — he still believes that the productive Threadripper is the processors of the Athlon line, with all the ensuing consequences.
The Linux kernel patch was written by developer Andy Grover (Andy Grover) and was personally approved by Linus Torvalds (Linus Torvalds), the creator of Linux. This patch introduced into the kernel support for ACPI, an open industry standard from 1996 that allows you to define a single interface for hardware discovery, power management, and configuration of the computer’s motherboard and devices.
Sometimes the holy of holies is to blame for processor slowdowns — OS 9 kernel0005
Update by Grover includes, among other things, the activation of the «dummy wait operation» (dummy wait op). As a result, the system read data for the sole purpose of delaying the next processor instruction until the CPU had the opportunity to completely stop using the STPCLK# instruction.
Grover’s patch undoubtedly brought its benefits, but by 2022 it has long lost its relevance. If at the time of 2002 the deployment of ACPI was still ongoing, and many CPUs were not yet able to switch to standby mode without this update and save energy, then 20 years later this problem was solved long ago. However, Andy Grover’s development can interfere with the work of modern AMD processors.
Patch for patch
At AMD, Grover’s creation is probably considered at least useless, at most harmful. Engineer Prateek Nayak of her staff has developed his own add-on to the Linux kernel that brings a «dummy wait for Zen processors» feature to it. AMD currently has three generations of this architecture on hand and is working on Zen 4 at an accelerated pace.
The Linux kernel is far from ideal. It is not known how many more such atavisms are in it
Prateik Nayak claims that all current AMD CPUs based on Zen architecture can work correctly in Linux environment even if Grover’s patch is not in the kernel. Moreover, the engineer bluntly stated that Grover’s 20-year-old experience negatively affects the performance of the company’s modern chips. According to him, this manifests itself at least in some workloads. Claiming that the Linux kernel contains code that slows down modern Epyc, Threadripper and Ryzen on an ongoing basis, Nyack apparently did not dare. Instead, he said that the problem becomes more noticeable as the number of cores in the processor increases. From this we can conclude that the chips of the Threadripper and Epyc lines suffer the most.
Everything worked
The AMD engineer proved the reliability of his theory and the efficiency of the patch he created by conducting several performance measurements. According to the data he received, Andy Grover’s patch in the Linux kernel is indeed extremely damaging to the performance of AMD processors.
Result available
So, in the version with the Nyack patch, one system produced a whopping minimum throughput of MB / s — it was 1390% higher compared to the same system, but without the Nyack code. The average MB/s throughput was 51% higher in favor of the Nyack solution.
Intel «in the house»
AMD and Intel are two arch-rivals in the x86 processor market for PCs, laptops and servers. They have been competing not for years, but for decades, and Andy Grover’s patch, it would seem, should have hooked Core along with Pentium, Celeron and Xeon.
International Salon of Inventors: Will Novosibirsk become a new center of attraction for innovators?
Industry innovation
However, modern Intel chips turned out to be immune to what Andy Grover released 20 years ago. Intel engineers, as it turned out, have long been aware of this problem, and therefore in the company’s processors for at least the last 10 years there is a function to bypass its patch for Linux.
Intel, by the way, is also ready to fix this problem 20 years ago — it was developed by an employee of the company Dave Hansen (Dave Hansen). He plans to submit it to kernel developers for the foreseeable future to consider integration into the Linux 6.0 kernel.
It should be noted that in the Windows family there are also tools to slow down the performance of modern CPUs. Such a “trick”, as CNews reported, is in the latest Windows 11. Microsoft tried to fix everything, but only exacerbated the problem. Only much later did she manage to cope with the task.
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Evgeny Cherkesov
AMD Changes Mobile Processor Naming Scheme News — NVIDIA WORLD
AMD has decided to change the naming of its CPU lineups. As far as laptops are concerned.
AMD unveiled accelerated Ryzen 6000 laptop processors at CES 2022, but so far there has been no clue about their performance. And now, the first entries have finally appeared in the Geekbench database.
This is an 8-core 16-thread Ryzen 9 6900HX processor in a Lenovo 82RG laptop with 28 GB of RAM and Windows 11 Pro. The base frequency of the processor is 3.3 GHz, and in Boost mode it reaches 4.84 MHz, which is only slightly less than AMD’s declared ceiling of 4.9GHz. In addition, the processor has 16 MB L3 cache and 4 MB L2 cache. The chip is equipped with integrated RDNA2 graphics with 12CU.
Based on the test results, the chip scored 1593 points in the single-threaded test, which is 12% faster than the Ryzen 9 5900HX. In the multi-threaded test, the results are much better — 10151 points, which is 33% more than in the previous generation.
Thus, the Ryzen 6000 processors will noticeably approach the performance of the 12th generation of Intel Core. However, the advantage will still remain on the side of the competitor. Relative to Core i9-12900H AMD chip will be 14% and 28% slower in the single-threaded and multi-threaded test, respectively.
The first laptops with Ryzen 6000 processors should be available in February. Then we should expect the appearance of more tests.
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Intel is preparing to release Alder Lake-P mobile processors with a heterogeneous architecture that will have up to 14 cores. AMD decided to go the other way, but they also want to increase the number of cores. At the same time, the upcoming Rembrandt-H are limited to 8 cores, but everything will change in the Phoenix-H and Raphael-H series.
Zen4 RDNA2
According to an insider, the AMD Ryzen 7000 series will include a range of Phoenix-H processors with 8 cores and 16 threads at power consumption up to 40 W, as well as a range of Raphael-H processors with 16 cores and 32 threads in the maximum configuration at power consumption more than 45 W. Both products will use the Zen 4 architecture and will be manufactured at 5nm.
Until recently, it was not known that AMD plans to change the purpose of desktop Raphael chips for mobile systems. As for the desktop version of Raphael, it is also not clear yet whether they will be limited to 16-core version, because AMD is going to manufacture them as chiplets, which means that the company will have a lot of room for configuration changes.
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Videocardz
AMD Ryzen 5000U series processors should be available in a few months. Both Zen 2 and Zen 3 architecture processors will be present in this series. And now information about their performance begins to appear on the Web.
Ryzen 7 5800U (Zen 3) added to Geekbench 5. This is an 8-core, 16-thread processor that is comparable to the Ryzen 7 5700U (Zen 2) which has a similar configuration. According to the leaked data, the new chip was 20% faster in the single-core test (1189vs. 1421), and 3.6% in the multi-threaded benchmark (6226 vs. 6450). Such results are quite comparable with what AMD itself says about the increase in performance per clock. According to her, the increase in IPC is 19%.
AMD Ryzen 7
In terms of specifications, the Ryzen 7 5800U has a base frequency of 1.9 GHz and 4.4 GHz in Boost mode. Its heat dissipation will be 10-25 W, and the graphics subsystem is implemented on the Vega architecture with 8 computing units with a frequency of 2.0 GHz.
Ryzen 7 5800U testing on Geeksbench 5
Ryzen 5000U processors should appear in laptops next year. The first announcements are expected at CES 2021 in January.
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If this leak is correct, then AMD decided to confuse its future customers a bit, since the Ryzen 5000U series includes both Zen 3 and Zen 2 processors, Cezanne and Lucienne. At the same time, Lucienne is an improved version of the Ryzen 4000 Renoir, while Cezanne is its successor based on Zen 3.
AMD Ryzen
Processor All processors have a configurable TDP ranging from 10W to 25W. The Cezanne series chips also feature double the L3 cache to 16MB.
As for the GPU, it’s still the Radeon Vega, but both versions of the processor have increased compute units and frequencies, making Ryzen 5000 better competitive with Intel Tiger Lake.
Ryzen 5000 Series | Zen Core | Cores/Threads | Zen 3 | 6/12 | 2,3 | 4,2 | 12 | 7 | 1,8 |
---|---|---|---|---|---|---|---|---|---|
Ryzen 5 5500U | Zen 2 | 6/12 | 2,1 | 4,0 | 8 | 7 | 1,8 | ||
Ryzen 3 5400U | Zen 3 | 4/8 | 2,6 | 4,0 | 8 | 6 | 1.6 | ||
Ryzen 3 5300U | Zen 2 | 4/8 | |||||||
Ryzen 5 4600U | Zen 2 | 6/12 | 2,1 | 4,0 | 8 | 6 | 1,5 | ||
Ryzen 5 4500U | Zen 2 | 6/ 6 | 2,3 | 4,0 | 8 | 6 | 1,5 | ||
Ryzen 3 4300U | Zen 2 | 4/4 | 2,7 | 3,7 | 4 | 5 | 1. |
When the Ryzen 5000U series of processors will be officially introduced is still unknown. Perhaps this will happen during CES 2021.
RyzenAPUCPUnotebooksAMD
comment on similar news And performance comparisons with the top-end Intel Core i9-9880H processor have already appeared.
Comparative tests of these processors showed that the chip from AMD turned out to be faster than the competitor in most cases. What’s more, AMD’s CPU heat dissipation is 35W, while Intel’s is 45W (and 90W cTDP). It is noteworthy that both processors have 8 cores and 16 threads.
AMD Ryzen 9 4900HS vs. Intel Core i9-9880H
Performance Comparison In CineBench R20, the AMD chip outperformed Intel by 11.9% at full 90W, by an astounding 33% when the i9-9980H was running at stock power, and by 54 % faster when cTDP is limited to 35 watts. It also turned out to be one and a half times faster than the fastest mobile processor Ryzen 7 3750H Picasso, manufactured using 12 nm technology.
The situation is similar with CineBench R15. AMD’s solution in nominal mode turned out to be 34% faster than Intel. 18% in Handbrake HEVC, 25% in Blender Classroom, and 35% in 7-Zip. In creative applications, the trend has continued. In processor benchmarks, such as 4K stabilization in Premiere, the AMD processor was 12.6% faster. Only in less parallelized tasks in Photoshop, AMD lost 12% to its competitor.
AMD Ryzen 9 4900HS Review, Move Aside Intel, Your Days of Laptop Domination Are Over
When it comes to gaming, performance varied from game to game.
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Dark Vision Hardware
According to DigiTimes, which did not name its industry sources, AMD expects to capture the fifth part of the notebook market in the first quarter of this year.
One of the main reasons why manufacturers switch to AMD processors is Intel’s perpetual shortage, which, according to Compal, will last until the end of this year.
Notebook makers expect the Intel processor shortage to peak in the second quarter of 2020, so they are already counting on supplies from AMD.
Analysts believe that AMD can reach 20% of the notebook market in the first quarter. This will be a notable increase for the company, which held 14.7% in Q3 2019, up 3.8% yoy. In Q2 2019, AMD’s mobile processor share was 14.1%, and in Q1 it was 13.1%.
Most computer makers are confident that Intel’s shortage will be over by summer, but Martin Wen, president of Compal Electronics, one of the world’s largest contract laptop manufacturers, believes CPU shortages will continue throughout the year.
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Tom’s Hardware
The company has prepared two basic models of mobile systems-on-a-chip Athlon 3000 Gold and 3000 Silver. Both have a heat dissipation of 15 W and are designed for use in ultra-portable low-cost laptops, converters and tablets. They support Windows x64 and will compete with the Intel Pentium Gold 5000U Whiskey Lake and Pentium Silver Gemini Lake Refresh processors.
Key Features of Athlon 3000
So far AMD’s product lines are represented by only two chips: Athlon Gold 3150U and Athlon Silver 3050U. They are based on the Dali platform and contain the core of the Zen architecture. The older model, Athlon Gold 3150U, has 2 cores and 4 threads with frequencies from 2.40 GHz to 3.30 GHz. The Athlon Silver 3050U processor has 2 cores and 2 threads with frequencies from 2.30 GHz to 3.20 GHz.
Athlon 3000 main features
Both versions have 4 MB of L3 cache, and the total amount of L2+L3 caches is 5 MB. The integrated graphics in the 3150U are the Radeon Vega 3 with 192 1.0 GHz stream processors, while the 3050U features the Vega 2 with 128 1.10 GHz stream processors.
Athlon 3000 performance
When notebooks with Athlon Gold 3150U and Athlon Silver 3050U will appear on the market, it has not yet been announced.
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TechPowerUp
Microsoft has announced that its 15” ultra-thin Surface Laptop 3s feature AMD processors. These are custom-designed chips that are «AMD’s fastest mobile processors for ultrathin laptops.» The company also promises «the world’s most productive graphics for ultra-thin laptops.»
AMD Ryzen Processors for Surface Laptop 3 have a custom design. These chips are different from the Ryzen Mobile 3000 series and the AMD Zen+ architecture. This means that they are manufactured according to 12 nm standards at GlobalFoundries factories. As for graphics, the Vega core is used in the chip.
Microsoft Surface Laptop 3
Officially, the CPUs are Ryzen 7 3780U and Ryzen 5 3580U. In terms of performance, they are between Ryzen 5 3500U and Ryzen 7 3700U, while TDP does not exceed 15 watts. The Ryzen 7 3780U variant has Vega 11 graphics, which is faster than the Vega 10 in the Ryzen 7 3700U. An interesting feature of this graphics, and indeed of the entire Surface Laptop 3, is AMD FreeSync support.
In terms of performance, AMD Ryzen 7 3780U GPU runs at 15-19% 3DMARK 11 and 3DMARK Time Spy than the GPU built into the Ryzen 7 3700U.
3DMARK 11 | 3DMARK Time Spy | |
---|---|---|
AMD Ryzen 7 3780U (Surface Edition) | 5 124 | 1 123,5 |
AMD Ryzen 7 3700U | 4 432,3 | 969 |
Intel i7-1065g7 (Ice Lake) | 4 910 | |
Intel i7-86665U | ||
Intel i7-8565U | 2 237.8 | 485.8 |
Thus, the unique level of customization that Intel could not offer with Ryzen was achieved by AMD.
RyzenCPUSurfacelaptopsAMDMicrosoft
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The new APUs offer good compute and fast graphics, saving manufacturers money, but still offering good power efficiency.
Ryzen Mobile
All this led to the interest of manufacturers, and the share of AMD processors in the notebook market increased from 9.8% to 15.8% over the year. Unfortunately, the main reason for the success is not in the AMD processors themselves. Although they are good, manufacturers use a scheme of work that has long been debugged with Intel, which they do not want to change at all. However, due to manufacturing problems with Intel, which cannot produce 14nm CPUs in sufficient volume, many brands have had to refocus.
Analysts predict that by the end of the second quarter, the share of AMD processors will rise to 18%, but the same value is called the maximum. Intel is expected to resolve production issues by the summer and be able to increase production by 25%. This will stop AMD’s growth in the mobile market.
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PC Games N
AMD published on its website Ryzen 7 2800h and Ryzen 5 2600h processors, which means the arrival of Architecture Raven Ridge to the game nuthoe.
These processors have Ryzen compute and Vega graphics. The new models are similar to their desktop counterparts, but have frequency optimizations to reduce power consumption. Thus, the power consumption in the chips is reduced to 45 watts. Manufacturers can use various options to reduce power consumption to 35 watts.
Ryzen Mobile
So, the Ryzen 7 2800H is similar to the 2400G, but its boost frequency is reduced to 3.3 GHz. It is a quad-core, eight-thread chip coupled with Vega 11 graphics up to 1300 MHz. The Ryzen 5 2600H chip is similar to the 2200G, it also has 4 cores and 8 threads. The graphics in this processor has 8 CUs with a frequency of 1100 MHz.
All this means an active expansion of the market for the company.
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Manufacturers and developers of mobile computers are extremely reluctant to adopt new AMD APUs. There are several mainstream laptops on the market with AMD processors, but no laptop manufacturer has placed an AMD chip in a flagship product. And things won’t change in the near future.
Mobile processors AMD
Some of the developers note that, despite the good performance of Ryzen Mobile, laptop designs have been tied to Intel for many years. And in most cases, OEMs simply can’t afford to take engineers on projects with uncertain success.
In the meantime, AMD has problems entering the notebook market. The company has a presence in low-end devices, and the rise to the premium segment will be long and difficult. Perhaps another excellent mobile APU that AMD will release in 2019 will fix the situation.year.
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Dark Vision Hardware
they found their confirmation.
Intel announced the completion of an enthusiast processor that will find its place in ultra-thin gaming laptops with high graphics and computing performance.
The new chip will reduce the overall area of the processors, and the AMD GPU will have a «semi-custom» design. This approach will provide graphics performance at the level of discrete solutions.
The H-series of processors will be the first consumer product to use the state-of-the-art Embedded Multi-Die Interconnect Bridge, allowing Intel and AMD components to work together. It will also be the first mobile processor to feature High Bandwith Memory 2 (HBM2). All this will reduce power consumption and save space inside the device, compared with a discrete system.
Intel Core H-series processors should be available in the first quarter of 2018. These systems are currently being tested by major OEMs.
New Intel Core Processor Combines High-Performance CPU with Discrete Graphics
In terms of performance, AMD’s semi-custom solution is rumored to compete directly with the GeForce GTX 1050. 2010
Notebooks based on the AMD Zacate platform will be delivered to the company’s partners in the fourth quarter of this year, and we will see the final products based on it in the first quarter of 2011.
Let me remind you that we are talking about an APU with a TDP level of no more than 18 W, intended primarily for the production of laptops, desktop systems and all-in-one PCs. Many expected the company to demonstrate dozens of devices based on the Fusion architecture already at the upcoming CES 2010, which will be held next January, but company representatives said that deliveries of the platform itself to partners will begin exactly after the exhibition.
AMD is positioning the platform for 15-inch machines that will cost $499 and up.
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fudzilla.com
Vulnerability allows launching attacks on a third-party channel and detecting 4096-bit RSA keys. This vulnerability was identified by several security researchers at Graz University of Technology in Georgia. They called it SQUIP: Exploiting the Scheduler Queue Contention Side Channel, and this fact is confirmed by AMD.
The hackers were using a common household CPU, and were able to gain access to information about the type of instructions used due to the design of the processor’s separate scheduler. At the same time, Apple’s M1 and M2 processors have a similar architecture, but they do not have SMT, and therefore do not have a similar problem. The abbreviation SMT stands for «simultaneous multithreading» — simultaneous multithreading. The technology improves the performance of superscalar processors by distributing computations to several independent threads.
To completely avoid exploitation of the vulnerability, disable SMT technology, however, this will drastically reduce performance. The vulnerabilities affect the Ryzen processors of the Zen 1, Zen 2 and Zen 3 microarchitectures. AMD has named the vulnerability AMD-SB-1039: Execution unit Scheduler Contention Side-Channel Vulnerability on AMD Processors and recommends that developers do not use programming methods dependent on secret technologies.
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Fudzilla
AMD has told investors that the Zen 4 Ryzen 7000 series of desktop processors will be available before October 2022. And the Wccftech website decided to guess when and what stages will accompany this.
So, on August 28, AMD will formally introduce the new generation of Ryzen 7000 CPUs and socket AM5 platforms.
The next stage has not yet been determined, but most likely it will take place on September 15th. On this day, the company will lift the ban on publications, so that’s when the first processor reviews will appear on the Web. But the chips will go on sale two days later — September 17.
AMD Zen 4
At first, only 4 CPU models will be available for purchase. These will be Ryzen 9 7950X and 7900X, Ryzen 7 7700X and Ryzen 5 7600X. The remaining models should be expected during 2023.
Along with the CPUs, there will also be motherboards with support for DDR5 memory, PCIe 5. 0 bus, and socket AM5. So far, three chipset models have been announced for these platforms: X670E, X670 and B650. Which of them will be available in September is not yet clear.
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TechPowerUp
AMD is developing custom Ryzen CPUs for several manufacturers, such as Lenovo. These Ryzen Pro processors are equipped with Microsoft’s Pluton security chips, which appear to limit the use of the OS.
Linux security expert Matthew Garrett decided to review Microsoft’s Pluton implementation on Ryzen Pro 6860Z Zen3+ processors, but ran into problems because Linux didn’t even install.
Microsoft Pluton Security Chip
The firmware does not appear to trust any non-Microsoft bootloader, nor any drivers using a third party UEFI CA key. In other words, it is impossible to install any OS other than Windows on a machine with this processor. Also, any third party peripheral connected via Thunderbolt will not work.
According to Garrett, the solution does not provide additional security, but only makes it more difficult for users to work with any operating system other than Windows. Fortunately, the Pluton chip can be disabled in UEFI, which will allow you to fully use the purchased computer.
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Kit Guru
Market analysts expect that AMD will soon risk losing a large part of its market, despite the current success.
Joseph Moore, an analyst at Morgan Stanley, in an interview with Seeking Alpha said that in the coming months, AMD will lose 26% of the market, which Intel will capture with its Alder Lake, 12th generation processors. These CPUs sell well for both desktop machines, thanks to their excellent gaming and creative applications, and laptops.
However, AMD believes that this state of affairs is only temporary. AMD’s Robert Hallock notes that thanks to the Zen 4 architecture, his company will be able to successfully compete with competitors. In addition, the company has now offered the Ryzen 7 5800X3D processor, which bridges the gap with Intel. As for the new chips for socket AM5, their release will also have a positive impact on the production of motherboards.
AMD’s plan is for a loyal customer base to wait for Zen 4, which promises significant performance gains across all platforms, as well as overclocking the 13th Gen Intel Core Raptor Lake.
In terms of laptops, observers note that laptop profits will grow by 35% in 2022 for both Intel and AMD. As for 2023, a stable situation is predicted for now.
Thus, the next release of Zen processors will put AMD in a catch-up position that the company has not been in since 2017. The main tool for promoting Zen 4 will be the traditional pricing policy.
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Fudzilla
AMD Ryzen 7000 Zen 4 CPUs will be available for sale on September 15, 2022. And the sales strategy for the new CPUs promises to be identical to the Ryzen 5000 series.
Initially, the company will release 4 processor models: Ryzen 9 7950X, Ryzen 9 7900X, Ryzen 7 7800X and Ryzen 5 7600X. AMD recently noted that this series will feature 16 cores and 32 threads. Obviously, this applies to the older model Ryzen 9 7950X. The number of cores of other models is still unknown.
AMD Introduces Processors for Socket AM5
All models will be available for socket AM5 and will work with PCI-Express Gen 5 bus and DDR5 memory. It has been said many times that socket AM5 will exclusively support the new generation of PCIe bus and DDR5 memory, but AMD has not abandoned the idea of giving Zen 4 processors legacy memory and bus.
It turns out that the company is designing some kind of processor with Zen 4 chipsets for socket AM4, with an existing cIOD model that supports PCI-Express Gen 4 and DDR4. According to rumors, these chips will be intended for the lower price segment, where current models of motherboards and cheaper memory can be used.
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If you haven’t been following the rumors, we are reporting that the new processor is based on the Zen 4 architecture, which is manufactured to 5nm. The chip has twice the L2 cache and a higher clock speed, up to 5.5 GHz in real-world gaming. The processor provides a 15% performance boost in a single thread. In addition, AMD demonstrated the performance of the CPU in a multi-threaded Blender task, where the rendering on the top AMD model turned out to be 30% faster than on the Intel Core i
0K.
Lisa Su Introduces AMD Ryzen 7000 Performance
In addition, the Ryzen 7000 series features an all-new 6nm I/O core, AMD RDNA 2 graphics, a new low-power architecture derived from Ryzen mobile processors, and a number of new communication technologies (DDR5, PCI Express 5.0, etc.) and support for up to four displays.
Thus, AMD enters into a closer fight with Intel in the higher price segment and hopes to gain a foothold in this market even more.
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comment when moving from Zen 2 to 3.
Petykemano reported testing an AMD 8-core, 16-thread, 5.21GHz processor running on the reference AM5 Splinter-RPL platform. It is not clear from the benchmark that we are talking about Zen 4 (Ryzen 7000), but the analysis of the OPN code says exactly this.
This data also states that the iGPU will be based on the RDNA2 architecture, and its performance will be similar to Vega/Xe-LP graphics, but most likely, the new AMD graphics have not worked at full capacity yet.
Moore’s Law Is Dead channel also reported fresh rumors that the processor clock speed could rise by 8-14% to 5.2 GHz. In addition, the increase in performance per cycle will be 15-24%. Thus, the overall increase in productivity will be 28-37%.
Other improvements include doubling the L2 cache per core to 1MB, more PCIe lanes, support for PCIe 5.0 and LPDDR5/DDR5 memory, improved AVX-512 performance (on par with Ice Lake-X). At the same time, the total number of cores, as well as the size of the L3 cache, will remain unchanged.
The first Zen 4 processors are expected to arrive later this year. These will be desktop and server solutions. Threadripper models will be available in the first half of 2023.
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KitGuru
The Surface Laptop 4 successor will get the best mobile processors in the low-power segment.
The Surface Laptop 5 will be available in two screen sizes: 13.5″ and 15″. The displays will have a classic device aspect ratio of 3:2 and a contrast ratio of 1500:1. In general, the display will be the same as the previous generation, except for the frame rate, which will now be 120 Hz.
Microsoft Surface Laptop 4
The older laptop will be based on a Core i7-1280P Alder Lake processor with 14 cores and 20 threads, or an AMD Ryzen 7 6980U Zen3+ architecture and up to 8 cores and 16 threads, which is an upgrade from the previous generation, where Intel Core i7-1187G7 and and Ryzen 7 4980U are used.
The 13.5” model will have a 6-core 12-thread Ryzen 5 6680U Rembrandt processor or a 12-core 16-thread Intel Core i5-1240P or Core i7-1280P.
Surface Laptop 5s finally get Thunderbolt 4 support, while the current generation only had a USB-C port with 3.1 Gen2 and DP 1.4/PD.
An interesting point concerns the description of the Ryzen 7 6980U model, which will support LPDDR4X memory. Unfortunately, this processor is ordered by Microsoft and its specifications are not publicly available. But it is known that laptop Rembrandt can work exclusively with DDR5 or LPDDR5 memory. It is possible that the Ryzen 7 6980U and Ryzen 5 6680U may be the first in the lineup to feature an LPDDR4X controller.
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Videocardz
Intel’s 12th generation processors have been incredibly successful. They demonstrate excellent performance, and AMD again fell behind.
Of course, AMD is preparing an updated Ryzen 7 5800X3D processor with 3D V-Cache for the spring, but this is clearly not enough to successfully compete with Intel. This is probably why there are new rumors about the imminent release of Zen 4 architecture processors. During CES 2022, AMD announced that it was preparing to release 5nm Zen 4 processors in the second half of 2022, but announcements of this magnitude are quite unusual for the company.
Lisa Su Introduces Ryzen 7000
Processors The source of the rumors is the Chiphell forum, where the user «getwinder» reported on supposedly new AMD plans. However, the widespread information about the expected performance of Zen 4 is much more interesting.
- According to rumors, the increase in the number of instructions per clock in Zen 4 will increase by 18% compared to the previous generation (it is not clear if it is in the form of Zen 3 or Zen 3D).
- The peak frequency, or the maximum frequency in Boost mode, on a single core will increase by 7%.
- Boost frequency on all cores will rise by 8.7%.
Thus, if the clock frequency on all cores reaches 5 GHz, then AMD will have real chances to take the lead in the competition again.
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One of the Chinese reviewers said that he got an engineering sample of such a processor, which he overclocked to a substantial 4.8 GHz.
This is a pair of engineering samples of Milan-X EPYC 7773x processors with a base clock speed of 2.1 GHz and a boost frequency of 3.4 GHz. This is only 100 MHz below the official specifications. Each of these processors has 64 cores, 128 threads and 804 MB of cache, 512 MB of which is 3D V-cache.
AMD EPYC
Processor The processors are installed in a two-socket SuperMicro motherboard, bringing the system to a total of 128 cores, 256 threads and 1608 MB of cache. In the Cinebench R23 test, the system with EPYC 7773x scored 936 points in a single-threaded test and 64894 in a multi-threaded one. In comparison, the Intel Core i9-12900K scores 1942 in the single-thread test and 26418 in the multi-thread test.
Kenaide reviewer also used Uat4’s EPYC Milan/Rome ES/QS processor overclocking tool and ExecutableFix, which unlock power limits and raise the frequency and voltage on all cores above the nominal ones. Thanks to this tool, the clock speed of the EPYC 7773x has been raised to 4.8 GHz on all cores. And this is a lot, as for a server processor.
All this means that the new generation of processors from AMD is not only almost ready for release, but also has outstanding overclocking potential.
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KitGuru
AMD CEO Lisa Su has officially confirmed that next-generation Ryzen and Radeon products will be released this year.
The company is developing new CPU architectures, Zen 4, and GPUs, RDNA3, that will power Ryzen 7000 series CPUs and Radeon RX 7000 series graphics cards. production capacity. This increase in production capacity will allow the company to successfully pass 2022.
AMD CEO Lisa Su
Both product lines are scheduled to be released in late 2022, with limited impact on the company’s 2022 earnings. But even so, AMD expects to make $21.5 billion in profit, up 31% from 2021. This increase in profits also means a significant increase in deliveries, which was the likely reason for the additional booking of production from TSMC.
Along with Zen 4, AMD plans to release a new AM5 platform that will support PCIe 5.0 interface and DDR5 memory. As for the Zen 4 architecture itself, compared to the current Zen 3, it will receive big changes, which will significantly increase performance.
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Overclock 3D
In the wake of the success of the Coole -9,0005, 9000 Systems 35. 2 models each, one for AMD processor and one for Intel. The i35 model can work with Intel LGA 1700, 1200, and 115x sockets, while the A35 model is designed for AM4 socket.
All equipped with 120mm P-Series PWM fans up to 1800rpm. The radiator used on all models is identical. It features a compact design that improves compatibility with various RAM modules. Each heatsink contacts the processor overlay through 4 heatpipes.
Arctic Freezer 35 CPU Cooler Family
According to the developers, this series of coolers has simplified the mounting process by using spring-loaded screws, which optimizes contact pressure and improves the distribution of pre-applied MX5 thermal paste.
One of the models is equipped with 12 LED A-RGB fans powered by a 3-pin 5V-DI-GND connector. The other has a standard RGB backlight with a 4-pin 12V-G-R-B connector.
In addition to the standard version of the Freezer 35, Arctic has also launched a CO (continuous operation) version for continuous operation. These coolers are equipped with fans with double ball bearings and have increased strength and reliability.
The Arctic Freezer 35 coolers are available now from 34 euros.
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