Slgeb: x86 cpus’ Guide — View details on Intel Core 2 Duo E8335 (2,93GHz)

19 июля, 2023

SLGEB | Intel Core 2 Duo E8335 2.93GHz 1066MHz FSB 6MB L2 Cache Socket FCPGA478 Mobile Processor


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Condition : Refurbished

Intel Core 2 Duo Mobile E8335 — AW80576GH0776M / AW80576GH0776ML / FF80576GH0776M Information



































Prozessorfamilie:


Intel Core 2 Duo Mobile


Prozessor Modell:


Prozessor:


2. 93/6M/1066


OEM/Tray OPN:


AW80576GH0776M / AW80576GH0776ML / FF80576GH0776M


Markteinfhrung:


04. 2008


Marktsegment:


Mobile


Prozessortakt:


2933 MHz


Systemtakt / Systembustakt:


266 MHz / 1066 MHz quad-pumped (bis zu 8,5 GB/sek Datentransfer)


Prozessortyp:


478-pin micro Flip-Chip Pin Grid Array (mFC-PGA)


Sockel:


Intel OEM/Tray sSpec:


Q4JN, Q6KV, QJFL, SLAQC, SLGEB


Low-Power Untersttzung:


Powermanagement
System Management Mode
* Taktkontrolle und Low-Power States
   # Core Low Power States
     — C1/AutoHALT Powerdown state
     — C1/MWAIT Powerdown state
     — Core C2, C3, C4, und C6 State
   # Package Low Power States
     — Stop Grant und Stop Grant snoop state
     — Sleep, Deep Sleep, Deeper Sleep and Enhanced Deeper Sleep state
     — Deep Power Down state
     — Dynamic Cache sizing
Enhanced Intel Speedstep Technology
Enhanced Dynamic Acceleration Technology
FSB Low Power Enhancements
     — Dynamic FSB Power Down
     — BPRI# control for address and control input buffers
     — Dynamic Bus Parking
     — Dynamic On-die termination disabling
     — Low VCCP (I/O termination voltage)
     — Dynamic FSB frequency switching
Processor Power Status Indicator (PSI-2) Signal
 — Both cores are in idle state
 — Only one core is in active state
 — Both cores are in active state


Kernspannung:


Temperaturbereich:


Verlustleistung:


Verlustleistung:


Mikroarchitektur:


Intel Core Mikroarchitektur (1. Generation)
Dual-Core Prozessor mit zwei physikalischen Prozessorkernen
14-stufige Pipeline
Dynamische Ausfhrung
Extended Memory 64 Technologie


Plattform:


Prozessorkern:


Penryn


Prozessorkern Stepping:


Anzahl Kerne:


Anzahl Threads:


Fertigungstechnologie:


Transistoren:


410. 000.000


Befehlssatzerweiterungen:


MMX, SSE, SSE2, SSE3, SSSE3 und SSE4.1


Adressierbarer Speicher:


262. 114 GB


Koprozessor:


On-Chip integriert


Integrierter Grafikprozessor:


Integrierte Komponenten:


2 x 64 KB Level1 Cache:


— 8-way set-associative
— je Kern jeweils 32 KB Befehls- und Datencache


6144 KB Level2 Cache:


— advanced transfer Cache
— 24-way set-associative
— gemeinsamer Befehls- und Datencache


Enhanced Floating Point und Multimedia Unit
Address Bus ( (bertrgt zwei Datenpakete pro Takt)
Quad-pumped FSB (bertrgt vier Datenpakete pro Takt)
** Prozessor Thermal Features
 — Thermal Diode
 — Thermal Diode Offset
 — Thermal Monitor
 — Digital Thermal Sensor
 — Out of Specification Detection
 — PROCHOT# Signal


Integrierte Funktionen:


Execute Disable Bit
Virtualization Technology
Trusted Execution Technology
Speculative execution
Branch prediction


Anmerkung:

* Dies ist ein undokumentierter Core 2 Duo Mobile Prozessor, mglicherweise stehen nicht alle genannten
  Penryn-Low-Power Features zur Verfgung.

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