Amd socket s1 638: S1 Socket list — Cpu Specs Benchmarks reviews cpu upgrade

Socket S1g1 — AMD — WikiChip

Socket S1, specifically S1g1, the first of four revisions, was a low-profile ZIF socket for OPGA-638-packaged AMD mobile microprocessors with an integrated DDR2 memory controller, and the successor to Socket 754 in the mobile segment. Its counterparts are Socket AM2 for desktop processors and Socket F for servers and workstations. For the small form factor desktop, ultrathin mobile, and embedded market AMD developed package ASB1. Socket S1g1 was superseded by Socket S1g2.

Socket S1g1 was used in AMD’s second and third mobile platform «Kite» (2006) and «Kite Refresh» (2007). All processors for Socket S1g1 are members of AMD’s Family 0Fh with CPU cores based on the K8 microarchitecture.

All revisions of Socket S1 have the same dimensions, however processors for Socket S1g1 appear to be electrically incompatible with all later revisions of this socket.

Contents

• 1 Features
• 2 Chipsets
• 3 Processors using Socket S1g1
• 4 Package Diagram
• 5 Socket Outline
• 6 Pin Map
  • 6. 1 Pin Description
• 7 References
• 8 See also

Features[edit]

• 638-pin lidless micro pin grid array package, 1.27 mm pitch, 26 × 26 pins, 35 × 35 mm, organic substrate, C4 (flip chip) die attachment

• 16 bit HyperTransport 1.0 interface up to 800 MHz, 1600 MT/s, 3.2 GB/s in each direction

• 128 bit DDR2 SDRAM interface up to 400 MHz, PC2-6400 (DDR2-800), 12.8 GB/s
  • Up to 2 unbuffered SO-DIMMs, no ECC support
  • JEDEC SSTL_1.8

• P-States, multiple ACPI compliant low-power states including C1E with AltVID, AMD PowerNow! technology

• Thermal Controls
  • Thermal protection
  • Hardware thermal control
  • Thermal diode

Chipsets[edit]

• AMD M690, M690V, M690E, M690T
• AMD SB600 southbridge
• Mvidia GeForce 7000M, 7150M, southbridge integrated

Processors using Socket S1g1[edit]

• «Kite» platform:
  • AMD Turion 64, codename «Richmond»
  • AMD Turion 64 X2 «Taylor», «Trinidat»
  • AMD Athlon 64
  • AMD Athlon 64 X2
  • AMD Sempron «Keene»
• «Kite Refresh» platform:
  • AMD Turion 64 X2 «Tyler»
  • AMD Athlon 64 X2 «Tyler»
  • AMD Athlon, AMD Athlon 64
  • AMD Sempron Dual Core
  • AMD Sempron «Sherman»

Package Diagram[edit]

OPGA-638 package dimensions as specified in AMD Publ. #31839. This is part no. 29249 with the chip used for Turion 64 «Richmond» and Sempron «Keene» processors. All dimensions in millimeters.

Socket Outline[edit]

Socket S1 limits as specified in AMD Publ. #31839. Depicted is Foxconn Interconnect Technology Part No. PZ6382A-284S-01F. All dimensions in millimeters.

Pin Map[edit]

For differences to other Socket S1 revisions see Socket S1g4.

Pin Description[edit]

Signal	Description
CLKIN_H/L	200 MHz Differential PLL Reference Clock
CPU_PRESENT_L	Processor is present, shorted to VSS on the package
DBREQ_L, DBRDY	Debug Request/Ready
HTREF0, HTREF1	HyperTransport Compensation Resistor to VSS, VLDT
L0_CADIN/OUT_H/L[15:0]	HT Link 0 Differential Command/Address/Data Input/Output
L0_CLKIN/OUT_H/L[1:0]	HT Link 0 Differential Clock Input/Output
L0_CTLIN_H/L[1:0]	HT Link 0 Differential Control Input/Output
LDTSTOP_L	HT Stop Control Input for power management and link width and frequency change
MA0/MB0_CLK_H/L[2:1]	DRAM Differential Clock
MA0/MB0_CS_L[3:0]	DRAM Chip Select
MA0/MB0_ODT[1:0]	DRAM Enable Pin for On Die Termination
MA/MB_ADD[15:0]	DRAM Column/Row Address
MA/MB_BANK[2:0]	DRAM Bank Address
MA/MB_CAS_L	DRAM Column Address Strobe
MA/MB_CKE[1:0]	DRAM Clock Enable
MA/MB_DATA[63:0]	DRAM Data Bus
MA/MB_DM[7:0]	DRAM Data Mask
MA/MB_DQS_H/L[7:0]	DRAM Differential Data Strobe
MA/MB_RAS_L	DRAM Row Address Strobe
MA/MB_WE_L	DRAM Write Enable
MEMVREF	DRAM Interface Voltage Reference
MEMZP, MEMZN	Compensation Resistor to VSS, VDDIO
PROCHOT_L	Processor in HTC-active state input/output
PSI_L	Power Status Indicator (low power state) for VDD regulator
PWROK	Voltages and CLKIN have reached specified operation
RESET_L	Processor Reset
RSVD	Reserved
SIC, SID	Sideband Temperature Sensor Interface Clock, Data
TCK, TDI, TDO, TMS, TRST_L	JTAG interface
TEST*	Test signal
THERMDA, THERMDC	Thermal Diode Anode, Cathode
THERMTRIP_L	Thermal Sensor Trip output
VDD	Core power supply
VDD_FB_H/L	Differential feedback to VDD regulator
VDDA	Filtered PLL supply voltage
VDDIO	DRAM I/O ring power supply
VDDIO_FB_H/L	Differential feedback to VDDIO regulator
VID[5:0]	Voltage ID for VDD regulator
VLDT_A/B	HyperTransport I/O ring power supply
VSS	Ground
VTT	DRAM Termination voltage
VTT_SENSE	VTT monitor pin

References[edit]

• «Low-Profile Socket S1 Design Specification», AMD Publ. #31839, Rev. 3.01, April 10, 2007
• «BIOS and Kernel Developer’s Guide for AMD NPT Family 0Fh Processors», AMD Publ. #32559, Rev. 3.16, October 31, 2009
• «AMD Turion™ 64 Mobile Technology Product Data Sheet», AMD Publ. #32816, Rev. 3.05, September 10, 2006
• «AMD Turion™ 64 X2 Mobile Technology Dual-Core Processor Product Data Sheet», AMD Publ. #41407, Rev. 3.02, September 10, 2006
• «AMD Athlon™ 64 X2 Dual-Core Processor for Notebooks Product Data Sheet», AMD Publ. #42989, Rev. 3.01, August 2007
• «Revision Guide for AMD NPT Family 0Fh Processors», AMD Publ. #33610, Rev. 3.48, December 13, 2011

See also[edit]

• Socket S1g2
• Socket S1g3
• Socket S1g4
• Socket AM2
• Socket F
• ASB1 Package

Facts about «Socket S1g1 — AMD»

RDF feed

designer	AMD +
first launched	May 17, 2006 +
instance of	package +
market segment	Mobile +
microarchitecture	K8 +
name	Socket S1g1 +
tdp	35 W (35,000 mW, 0. 0469 hp, 0.035 kW) +

Socket S1g2 — AMD — WikiChip

Socket S1g2 was the second socket for OPGA-638-packaged AMD mobile microprocessors with an integrated DDR2 memory controller, and the successor to Socket S1g1. It was superseded by Socket S1g3.

The main improvements of Socket S1g2 over S1g1 are support for HyperTransport generation 3.0 and separate power planes for each core and the northbridge, a power saving feature. S1g2 processors support dual plane platforms supplying the same voltage to both cores, but not a single plane supplying the northbridge as well.

Socket S1g2 was used in AMD’s «Puma» mobile platform. All processors for Socket S1g2 are members of AMD’s CPU Family 11h.

All revisions of Socket S1 have the same dimensions, however processors for Socket S1g2 appear to be electrically incompatible with Socket S1g1. Socket S1g2 and S1g3 have the same pinout, if processors for these sockets are exchangeable is unclear. Socket S1g2 processors will not work in Socket S1g4 systems, which use DDR3 memory, but S1g4 processors which support both DDR2 and DDR3 memory may be compatible with Socket S1g2 if the BIOS recognizes the CPU.

Contents

• 1 Features
• 2 Chipsets
• 3 Processors using Socket S1g2
• 4 Package Diagram
• 5 Socket Outline
• 6 Pin Map
  • 6.1 Pin Description
• 7 References
• 8 See also

Features[edit]

• 638-pin lidless micro pin grid array package, 1.27 mm pitch, 26 × 26 pins, 35 × 35 mm, organic substrate, C4 (flip chip) die attachment

• 16 bit HyperTransport 3.0 interface up to 1800 MHz, 3600 MT/s, 7.2 GB/s in each direction

• 2 × 64 bit DDR2 SDRAM interface up to 400 MHz, PC2-6400 (DDR2-800), 12.8 GB/s
  • Up to 2 unbuffered SO-DIMMs, no ECC support
  • JEDEC SSTL_1.8

• Power Management
  • AMD PowerNow! technology
  • Up to 8 P-states; ACPI C1, C1E, C2, C3, S1, S3, S5
  • Triple power planes
  • HT link power management

• Thermal Controls
  • Thermal protection
  • Hardware thermal control
  • DRAM thermal protection
  • Thermal diode

Chipsets[edit]

• AMD M780G, M780V
• AMD 880M
• AMD SB700, SB710, SB820 southbridge

Processors using Socket S1g2[edit]

• AMD Turion X2 Ultra, codename «Griffin»
• AMD Turion X2
• AMD Athlon X2
• AMD Sempron «Sable»

Package Diagram[edit]

No data available. Dimensions should be similar to those of the OPGA-638 package shown on the Socket S1g1 page.

Socket Outline[edit]

Socket S1 limits as specified in AMD Publ. #31839. Depicted is Foxconn Interconnect Technology Part No. PZ6382A-284S-01F. All dimensions in millimeters.

Pin Map[edit]

For differences to other Socket S1 revisions see Socket S1g4.

Pin Description[edit]

Signal	Description
ALERT_L	Programmable pin that can indicate different events, including a SB-TSI interrupt
CLKIN_H/L	200 MHz Differential PLL Reference Clock
DBREQ_L, DBRDY	Debug Request/Ready
HT_REF0, HT_REF1	HyperTransport Compensation Resistor to VSS, VLDT
KEY1, KEY2
L0_CADIN/OUT_H/L[15:0]	HT Link 0 Differential Command/Address/Data Input/Output
L0_CLKIN/OUT_H/L[1:0]	HT Link 0 Differential Clock Input/Output
L0_CTLIN_H/L[1:0]	HT Link 0 Differential Control Input/Output
LDTREQ_L	HT link is active or requested by a device input/output
LDTSTOP_L	HT Stop Control Input for power management and link width and frequency change
MA0/MA1/MB0_CS_L[1:0], MB1_CS_L[0]	DRAM Chip Select
MA0/MA1/MB0_ODT[1:0], MB1_ODT[0]	DRAM Enable Pin for On Die Termination
MA/MB_ADD[15:0]	DRAM Column/Row Address
MA/MB_BANK[2:0]	DRAM Bank Address
MA/MB_CAS_L	DRAM Column Address Strobe
MA/MB_CKE[1:0]	DRAM Clock Enable
MA/MB_CLK_H/L[7/5/4/1]	DRAM Differential Clock
MA/MB_DATA[63:0]	DRAM Data Bus
MA/MB_DM[7:0]	DRAM Data Mask
MA/MB_DQS_H/L[7:0]	DRAM Differential Data Strobe
MA/MB_RAS_L	DRAM Row Address Strobe
MA/MB_WE_L	DRAM Write Enable
MEMHOT_L	DRAM Thermal Protection input
M_VREF	DRAM Interface Voltage Reference
M_ZP, M_ZN	Compensation Resistor to VSS, VDDIO
PROCHOT_L	Processor in HTC-active state input/output
PWROK	Voltages and CLKIN have reached specified operation
RESET_L	Processor Reset
RSVD	Reserved
SIC, SID	Sideband Temperature Sensor Interface (SB-TSI) Clock, Data
SVC, SVD	Serial Voltage ID Interface Clock, Data
TCK, TDI, TDO, TMS, TRST_L	JTAG interface
TEST*	Test signal
THERMDA, THERMDC	Thermal Diode Anode, Cathode
THERMTRIP_L	Thermal Sensor Trip output
VDD0	Core 0 power supply
VDD0_FB_H/L	Differential feedback to VDD0 regulator
VDD1	Core 1 power supply
VDD1_FB_H/L	Differential feedback to VDD1 regulator
VDDA	Filtered PLL supply voltage
VDDIO	DRAM I/O ring power supply
VDDIO_FB_H/L	Differential feedback to VDDIO regulator
VDDNB	Northbridge power supply
VDDNB_FB_H/L	Differential feedback to VDDNB regulator
VLDT_A/B	HyperTransport I/O ring power supply
VSS	Ground
VTT	DRAM Termination voltage
VTT_SENSE	VTT monitor pin

References[edit]

• «Low-Profile Socket S1 Design Specification», AMD Publ. #31839, Rev. 3.01, April 10, 2007
• «BIOS and Kernel Developer’s Guide (BKDG) For AMD Family 11h Processors», AMD Publ. #41256, Rev. 3.00, July 7, 2008
• «AMD Turion™ X2 Ultra Dual-Core Mobile Processors and AMD Turion™ X2 Dual-Core Mobile Processor Model Numbers», amd.com, archived February 2010
• «Revision Guide for AMD Family 11h Processors», AMD Publ. #41788, Rev. 3.00, July 2008
• «AMD Family 11h Processor Power and Thermal Data Sheet for Notebooks.pdf», AMD Publ. #43373, Rev. 3.00, August 13, 2007

See also[edit]

• Socket S1g1
• Socket S1g3
• Socket S1g4

Facts about «Socket S1g2 — AMD»

RDF feed

designer	AMD +
first launched	June 4, 2008 +
instance of	package +
market segment	Mobile +
name	Socket S1g2 +
tdp	35 W (35,000 mW, 0. 0469 hp, 0.035 kW) +

AMD Athlon 2 Socket S1 in the «Technique and Electronics» category

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Socket S1: Processors and Specifications

Socket S1 is a connector that is located on mobile devices, that is, laptops. This socket is designed for late AMD Athlon 64, Turion 64 and Sempron processors. Notebooks with this connector appeared in May 2006, they could already support processors with two core threads at that time. Socket S1 laptop processors have 638 pins.

Connector characteristics

Despite the fact that there are four versions of this connector, Socket S1 are different in ending, completely incompatible with each other. Different sockets support different processors.

The first version of the S1G1 mobile connector can support up to two RAM streams, the frequency of each of them does not exceed 800 megahertz. In terms of microarchitecture, the K8 family provides x86 compatibility. Socket S1G1 was developed using HyperTransport technology version 1.0. It features a bi-directional serial parallel whose bus provides high throughput with minimal latency. The exact data transfer rate reaches up to 12.8 gigabytes per second, while the Socket S1G1 bus width is 32 bits.

The next version, ending in G2, differs from the previous one only in the version of HyperTransport. This third release technology has achieved an operating frequency of over two gigahertz, with a bus width of 32 bits and a data transfer rate of up to 41 gigabytes per second.

The third version of Socket S1G3 already belongs to the K10.5 family, which supports multi-core processors with clock speeds up to 10 GHz. The calculations have doubled, that is, from 32 bits to 64 bits. There is the prospect of working with DDR3 RAM, and a third-level cache is also supported to work with all cores.

Features of the latest version

The latest version, which is called Socket S1G4, is also used exclusively for mobile computers and is codenamed «Danube». This connector was already in laptops that hit the market in 2010. The versatility of this connector is that it can work with both single-core Socket S1 laptop processors and those with four cores. The main thing is that the maximum frequency should not exceed 3.2 gigahertz. But it will be impossible to work with processors of previous versions, since they have a completely different architecture.

Suitable processors

The processors for Socket S1 of the first versions were different, but two of the most popular of them were marked for the G1 variant.

The AMD Mobile Sempron 3200+ processor is called the Manila core, which has a frequency of 1.8 GHz. The core in the amount of one piece has a single computation thread and a 64-bit first-level cache, and a 128-bit second-level cache. Support for RAM in the amount of two strips, the format of which is DDR2. The amount of energy consumed is 65 watts. Technological process is 90 nanometers.

The next Socket S1 processor, in comparison with the previous one, already has two cores with dual computation threads. AMD Turion X2 RM70 has a frequency of two gigahertz, and this figure is taken from each core, that is, four gigahertz in total. Memory-cache of the second level allows you to process information at a speed of 512 kilobytes. On 638 transistors there is a technological process with a size of 65 nanometers. Power consumption is low — only 31 watts. This processor is designed for the Socket S1G2 version.

ASUS F3T/F3TC REV2.2 Motherboard with S1 Socket

Motherboard based on AMD chipset has its own form factor called ATX. Supported RAM — DDR2, but not more than 8 gigabytes in total. The hard disk interface conforms to the SATA format, which greatly increases the speed of reading and writing files compared to the previous version of the format. There is a VGA port, USB outputs of the second version, RJ-45 connector for wired Internet connection. Also, for accessing the network in a wireless version, there is a Wi-Fi adapter available, whose maximum data transfer rate is 100 megabits per second.

As for the video adapter, it is built-in — NVIDIA GeForce Go 7300, its video memory capacity is 256 megabytes, which is not bad at all for a 2007-8 laptop. The screen resolution corresponds to the standard 1280×800, which indicates a diagonal of 15.4 inches. To conduct a conversation in video mode, there is a webcam with a quality of 1.3 megapixels and a built-in microphone. Connectors of various formats are also available for displaying images on other monitors and TVs. Built-in speakers provide high-quality sound with the help of an audio adapter from Intel High Definition.