All in one liquid coolers: Best AIO Water Coolers 2019

The injector is vital to the operation of your engine. It takes fuel from the fuel pump and releases it as tiny droplets that are easily mixed with air, which ensures easy and complete combustion of the mixture in the engine.

What fouls the fuel system?

The capacity of the injector may be reduced due to deposits and deposits that form after the machine has stopped. This is due to the fact that high temperatures (which remain in the engine for some time after stopping) can ignite the remaining fuel accumulated in the injector. As a result, soot and plaque remain. nine0002 The weakening of the injection immediately makes itself felt in the process of driving a deterioration in performance, an increase in fuel consumption, a lack of power.
In addition, the quality of gasoline affects the fuel system. Small mechanical particles in gasoline tend to accumulate, polluting the system.
Fact: Keeping your injectors clean will improve engine performance, improve acceleration and reduce emissions. It might even help you save some money. nine0011

What is the benefit of cleaning the fuel system?

Here are some reasons to keep your fuel system clean: optimal engine performance and minimal fuel consumption.
Cleaning the fuel system is important to remove contaminants from the injector. Such pollution reduces the intensity of injection, which worsens all engine performance. It should be noted that some models are very sensitive to the state of the fuel system, and some are not. It all depends on the design features. nine0011

What are the signs that the fuel system needs to be cleaned?

By thinking about this question, you are one step closer to improving fuel economy and optimal engine performance. Your fuel system needs service if you notice the following symptoms:
1. Intermittent engine operation. When you shift gears, you may find that the car accelerates in an unusual, jerky manner. Alternatively, this indicates poor fuel injection. It also means that more gasoline is burned and the load on the pump increases. nine0002 2. You began to refuel more often (with the same mileage). Just because your car gets older doesn’t mean you need to fill up more frequently. Deterioration in fuel efficiency may be due to contamination of the fuel system. Clogging of the injector leads to the injection of droplets that are not optimal in size, which prevents complete combustion of the fuel. Hence the higher fuel consumption.
In the most extreme case, clogging causes the injector to not close at all, which means fuel leakage and a sharp increase in consumption. nine0011

How often should the fuel system be cleaned?

We recommend doing this every year to prevent unpleasant effects. If your manufacturer recommends their own interval, you should stick to it.
Clean your fuel system and you’ll get more miles on a single tank.

What is included in the fuel system cleaning service?

During cleaning in our service, the following operations are performed:
1. The highest quality cleaner is poured into the tank, which flushes the system from the tank to the exhaust pipe. The cleaner effectively dissolves plaque and soot. Its additives allow you to completely clean the injector or carburetor, intake valves and combustion chamber. Excess moisture is also removed from the system.
2. Manually clean the throttle and throttle body with a special triple action cleaner. This will ensure effective removal of carbon deposits, debris and other contaminants. The throttle is lubricated for additional corrosion protection. nine0002 3. Full engine flush with cleaning agent. This approach allows you to clean the internal elements of the motor, including valves and the combustion chamber. The cleaner softens hard carbon deposits, making them easy to remove. As a result, the accumulation of soot will decrease, and emissions of harmful gases will decrease.
4. Providing a guarantee.

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Fluid Coolers for Power Electronics

Introduction

Efficient cooling systems are an integral part of power semiconductor electronics. For the full use of power semiconductor devices (PSD) in converters, intensive cooling is necessary. For semiconductor devices of tablet and modular designs, the domestic industry produces air coolers with clamping and compression force control systems, fasteners, tires and other accessories [1]. Of the latest developments, it should be noted the coolers of the O273, O473, O19 series3 [2], designed for high-power tablet SSS, which allow implementing projects for the creation of converters with a power of up to several tens of megawatts. Air coolers are produced by extrusion with a maximum width of up to 300 mm, which is often not enough to create powerful converters.

To implement high-power converters, it is necessary to use more efficient cooling systems of a new generation with a large heat transfer area for single and group placement of semiconductor devices or modules in power circuits. These include coolers O57 and O58, which are manufactured using a new technology — the method of pressing fins. This technology makes it possible to manufacture coolers with a width of 50–900 mm, which significantly expands the power range of power assemblies. For diode-thyristor and IGBT modules, O55 and O56 monoplate coolers have been developed and supplied, on the basis of which various multi-module power circuits can be created.

As the power density of semiconductor products of power electronics increases, the problem of removing heat losses from a small volume of a semiconductor chip arises, and when certain conditions are reached, air cooling does not provide the specified operating conditions for the SPS. Currently, the maximum power dissipation achieved with air-cooled coolers is 2 kW, and with liquid coolers — 5.5 kW. The heat capacity of liquid coolants is much higher than gaseous ones, so liquid cooling systems have better efficiency. At the same time, when designing and manufacturing reliable liquid cooling systems, it is necessary to solve a number of technical problems associated with the existing technological limitations. nine0011

Fluid Coolers for Tablet PCS

Fluid Coolers are designed to remove heat generated from power semiconductors and modules by heat exchange with the circulating coolant. Their main advantages in comparison with air coolers are the ability to remove more heat per unit time with smaller dimensions, as well as a lower noise level during the circulation of the coolant.

Industrial production of liquid coolers of the OM series, designed for individual cooling of thyristors and diodes, has been mastered for tablet devices. Among the latest developments, liquid coolers OM207 and OM209 should be highlighted.(Fig. 1) with reduced thermal resistance R _thha in comparison with a series of coolers OM107 and OM109. The use of these coolers is possible for devices with a semiconductor element diameter of 63–76 mm (OM207), 90–101 mm (OM209). Structurally, the coolers of these series are made in the form of copper heat sinks with current leads and fittings for supplying liquid, complete with an insulator and a clamping device. The insulator is placed between the heat sink and the clamping device, providing electrical isolation of current-carrying elements from structural parts. All coolers have a corrosion-resistant protective coating. nine0011

Fig. 1. Coolers:
a) OM207;
b) OM209

Cooler OM110 was developed for high-power semiconductor thyristors of tablet design with a semiconductor element diameter of 120 mm (Fig. 2). To ensure a reliable clamping contact, a clamping device was developed that provides a compression force of 130 kN. The diameter of the contact surface of the heat sink OM110 is 155 mm.

Fig. 2. Cooler OM110

The devices presented above are mainly intended for cooling single devices of tablet execution, while cooling of several SPPs assembled in a column is possible, provided that appropriate measures for the electrical isolation of each device are provided. In any case, the refrigerant is supplied through hoses, which increases not only the overall dimensions of the product, but also the number of connections, which in turn increase the likelihood of fluid leakage. The individual type of cooling is very effective, especially if several kilowatts of thermal power must be removed with a low flow rate (about 6 l / min). At the same time, the pressure drop for each element is quite acceptable for pumping liquid, but for the entire system, a hydraulic pump and a heat exchanger will additionally be needed — common to all coolers or individual ones. In a number of applications, building systems based on coolers of the OM series is inconvenient for the consumer. The modern development of converters using modular devices provides many advantages in the construction of power circuits, where liquid coolers for group placement of devices are in demand to increase their power. nine0011

Fluid coolers for power modules

One of the current trends in the design of semiconductor devices in power electronics is the development of IGBT, SFRD, MOSFET, diodes and thyristors in modular design. Structurally, the use of modules has a number of undeniable advantages: the isolated base of the modules from potential contacts; Simplified installation and busbar arrangement of power circuits, which allows to reduce their cost in comparison with tablet-type devices. Despite the fact that the design of high-power power diode-thyristor, IGBT- and MOSFET-modules with an insulated base requires only one-sided cooling, the construction of circuits using them is becoming increasingly popular. At the same time, one of the important stages in their design is the choice of an efficient cooler. nine0011

Modeling

The first stage in the development and design of a cooling device is mathematical modeling, which takes into account the electrophysical processes in coolers that occur in real operating modes. For calculations, the flow rate of cooling water and the total power loss generated by the heat source are set. The main characteristics of the cooling device are calculated: thermal resistance and pressure drop of the coolant flow. nine0011

Let’s consider the calculation process using the example of a milled cooler with dimensions 240 × 145 × 21 mm, designed to cool one IGBT module, in an MI8 package with base dimensions 190 × 140 mm (Fig. 3). A schematic representation of the design of the cooler with the representation of the channels is shown in fig. 4. For more efficient heat removal from modules, the arrangement of channels is set depending on the placement of semiconductor crystals in the module.

Fig. 3. Fluid cooler with IGBT power module installed

4. Typical

Fluid Cooler Cooling Port Design

Figures 5 and 6 show the final results of calculations of thermal resistance and cooling water flow rate. On fig. Figure 5 shows the distribution of the temperature field of the “module-cooler” system. The calculation of the temperature field makes it possible to identify the most critical temperature regions, for which, in some cases, additional optimization of the cooler design is required. On fig. Figure 6 presents the results of a hydrodynamic calculation, which makes it possible to identify, among other things, areas of coolant stagnation, which significantly reduce the efficiency of heat removal. nine0011

Fig. 5. Results of calculating the thermal field of the module and cooler

6. Calculation results of coolant flow distribution

Design and technology of liquid coolers

Coolant channels can be made in various ways: milling, drilling, pressing tubes into the base plate, etc. Organization of various parallel and sequential flows coolant is carried out using connecting pipes or fittings, threaded rods, as well as using a collector supply of coolant. nine0011